B81C 1/00222
Integrating an electronic processing unit with a micromechanical structure
Official title: {Integrating an electronic processing unit with a micromechanical structure}
B81C1/00222 (Integrating an electronic processing unit with a micromechanical structure) appears on 1,395 US grants and 1,513 published applications in this corpus.
Search patents in B81C- Granted patents
- 1,395
- Published applications
- 1,513
- Assignees
- 450
- Inventors
- 2,236
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 6 | 0 |
| 1997 | 6 | 0 |
| 1998 | 16 | 0 |
| 1999 | 7 | 0 |
| 2000 | 14 | 0 |
| 2001 | 9 | 3 |
| 2002 | 13 | 9 |
| 2003 | 16 | 20 |
| 2004 | 19 | 32 |
| 2005 | 20 | 31 |
| 2006 | 20 | 34 |
| 2007 | 32 | 46 |
| 2008 | 30 | 55 |
| 2009 | 20 | 61 |
| 2010 | 62 | 78 |
| 2011 | 55 | 76 |
| 2012 | 69 | 61 |
| 2013 | 67 | 83 |
| 2014 | 87 | 117 |
| 2015 | 79 | 124 |
| 2016 | 131 | 113 |
| 2017 | 119 | 114 |
| 2018 | 81 | 82 |
| 2019 | 99 | 74 |
| 2020 | 74 | 73 |
| 2021 | 56 | 45 |
| 2022 | 40 | 56 |
| 2023 | 40 | 35 |
| 2024 | 37 | 34 |
| 2025 | 40 | 37 |
| 2026 | 20 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B81C 1/00246Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on618
- B81C 1/0023Packaging together an electronic processing unit die and a micromechanical structure die426
- B81C 1/00238Joining a substrate with an electronic processing unit and a substrate with407
- B81C 1/00253Processes for integrating an electronic processing unit with a micromechanical structure not43
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- Mems microphone and mems accelerometer on a single substrate27 Aug 2026US 2026/0250120 A1Taiwan Semiconductor Manufacturing Company.Ltd
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- Micro-electro-mechanical system package20 Aug 2026US 2026/0242212 A1Vanguard International Semiconductor Corporation
Most cited
By later US patents
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- Vertical system integration289US 7,402,897 B2Elm Technology Corporation · 2008
- Lithography device for semiconductor circuit pattern generator287US 7,242,012 B2Elm Technology Corporation · 2007
- Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips273US 9,368,429 B2Intel Corporation · 2016