B81C 1/00253
Processes for integrating an electronic processing unit with a micromechanical structure not
Official title: {Processes for integrating an electronic processing unit with a micromechanical structure not provided for in B81C1/0023 - B81C1/00246}
B81C1/00253 (Processes for integrating an electronic processing unit with a micromechanical structure not) appears on 43 US grants and 47 published applications in this corpus.
Search patents in B81C- Granted patents
- 43
- Published applications
- 47
- Assignees
- 29
- Inventors
- 86
- Latest grant
- 28 Jan 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 1 |
| 2003 | 2 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 2 |
| 2007 | 1 | 3 |
| 2008 | 0 | 5 |
| 2009 | 1 | 3 |
| 2010 | 7 | 2 |
| 2011 | 3 | 1 |
| 2012 | 1 | 1 |
| 2013 | 1 | 1 |
| 2014 | 2 | 5 |
| 2015 | 1 | 2 |
| 2016 | 4 | 4 |
| 2017 | 7 | 2 |
| 2018 | 1 | 2 |
| 2019 | 2 | 1 |
| 2020 | 1 | 4 |
| 2021 | 0 | 2 |
| 2022 | 4 | 4 |
| 2023 | 3 | 0 |
| 2024 | 1 | 0 |
| 2025 | 1 | 0 |
By publication year.
Recent patents
- Sensor and method for reducing an interference signal component in a measuring signal from a sensor28 Jan 2025US 12,209,885 B2Robert Bosch GmbH
- MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portion19 Mar 2024US 11,932,534 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Wafer level stacked structures having integrated passive features26 Dec 2023US 11,854,958 B2General Electric Company
- Composite structures14 Nov 2023US 11,814,284 B2Cirrus Logic, Inc.
- Semiconductor structures22 Aug 2023US 11,736,866 B2Cirrus Logic, Inc.
- Sensor and method for reducing an interference signal component in a measuring signal from a sensor1 Dec 2022US 2022/0381583 A1Robert Bosch GmbH
- Wafer level stacked structures having integrated passive features17 Nov 2022US 2022/0367339 A1General Electric Company
- Method for manufacturing a mems device by first hybrid bonding a cmos wafer to a mems wafer30 Jun 2022US 2022/0204340 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor structures24 Feb 2022US 2022/0060835 A1Cirrus Logic International Semiconductor Ltd.
- Wafer level stacked structures having integrated passive features29 Apr 2021US 2021/0125918 A1General Electric Company
Most cited
By later US patents
- Integrated circuit on high performance chip89US 8,048,766 B2Commissariat A L' Energie Atomique · 2011
- Apparatus comprising and a method for manufacturing an embedded MEMS device53US 9,593,009 B2Infineon Technologies AG · 2017
- Method for making a module including a microplatform24US 6,569,754 B2The Regents of the University of Michigan · 2003
- Integrated passive device and method of fabrication23US 7,663,196 B2Freescale Semiconductor, Inc. · 2010
- Module and method of making same22US 6,667,558 B2The Regents of the University of Michigan · 2003