Semiconductor structures
AssigneeCirrus Logic, Inc.
InventorsRkia Achehboune, Roberto Brioschi
Life of this patent
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Abstract
The present application relates to structures for supporting mechanical, electrical and/or electromechanical components, devices and/or systems and to methods of fabricating such structures. The application describes a primary die comprising an aperture extending through the die. The aperture is suitable for receiving a secondary die. A secondary die may be provided within the aperture of the primary die.
Claims27
A semiconductor wafer comprising a plurality of primary die portions, each primary die portion configured to define a primary die following dicing of the semiconductor wafer, wherein at least one primary die portion comprises a plurality of apertures, each aperture extending through the semiconductor wafer from an upper surface of the semiconductor wafer to a lower surface of the semiconductor wafer, wherein each aperture is suitable for receiving a respective secondary die.
A primary die comprising a plurality of apertures each extending through the primary die from an upper surface of the primary die to a lower surface of the primary die, wherein each aperture is suitable for receiving a respective secondary die, wherein a first secondary die is provided within one of the plurality of apertures and wherein a second secondary die is provided within another of the plurality of apertures.
Dependencies are inferred from the claim text.