US 7,663,196 B2 · Integrated passive device and method of fabrication

Abstract

A device 20 includes substrates 22 and 24 coupled to form a volume 32 between the substrates. A surface 28 of the substrate 22 faces a surface 30 of the substrate 24. A metal-insulator-metal capacitor 34 is formed on one of the surfaces 28 and 30. A conductive element 58 spans between a top electrode 56 of the capacitor 34 and the other surface 28 and 30. Vias 64 and 66 extend through the substrate 22 and are electrically interconnected with the conductive element 58 and a bottom electrode 52 of the capacitor 34. Another device 72 includes an underpass transmission line 92 formed on a surface 80 of a substrate 74 within a volume 84 formed between the substrate 74 and another substrate 76. The line 92 underlies an integrated device 96 formed on a surface 78 of the substrate 74.

Claims15

Dependent claims

A device comprising:

a first substrate having a first surface and a second surface opposing said first surface;
a second substrate coupled to said first substrate to form a volume between said first and second substrates, said second substrate having a third surface facing said second surface of said first substrate;
an integrated device formed on a first one of said second and said third surfaces within said volume, said integrated device including a top electrode and a bottom electrode;
and
a conductive element spanning between said top electrode of said integrated device and a second one of said second and said third surfaces, said conductive element being in continuous contact with both of said top electrode and said second one of said second and third surfaces.

2 more elements

A device comprising:

a first substrate having a first surface and a second surface opposing said first surface;
a second substrate coupled to said first substrate to form a volume between said first and second substrates, said second substrate having a third surface facing said second surface of said first substrate;
a capacitor formed on a first one of said second and said third surfaces within said volume, said capacitor including a bottom electrode and a top electrode;
a first conductive element spanning between said top electrode and a second one of said second and said third surfaces, said first conductive element being in continuous contact with both of said top electrode and said second one of said second and third surfaces;
and
a second conductive element spanning between said second and said third surfaces, said second conductive element being in electrical communication with one of said bottom electrode and said first conductive element.

3 more elements

Dependencies are inferred from the claim text.

Integrated passive device and method of fabrication

Life of this patent

Integrated passive device and method of fabrication

Life of this patent

Abstract

Claims15