B81C 1/00238
Joining a substrate with an electronic processing unit and a substrate with
Official title: {Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure}
B81C1/00238 (Joining a substrate with an electronic processing unit and a substrate with) appears on 407 US grants and 481 published applications in this corpus.
Search patents in B81C- Granted patents
- 407
- Published applications
- 481
- Assignees
- 158
- Inventors
- 757
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 3 |
| 2003 | 2 | 5 |
| 2004 | 4 | 11 |
| 2005 | 8 | 8 |
| 2006 | 7 | 5 |
| 2007 | 5 | 6 |
| 2008 | 9 | 9 |
| 2009 | 2 | 10 |
| 2010 | 5 | 13 |
| 2011 | 9 | 13 |
| 2012 | 13 | 13 |
| 2013 | 11 | 28 |
| 2014 | 23 | 38 |
| 2015 | 24 | 54 |
| 2016 | 53 | 49 |
| 2017 | 53 | 39 |
| 2018 | 32 | 31 |
| 2019 | 27 | 23 |
| 2020 | 18 | 23 |
| 2021 | 22 | 18 |
| 2022 | 14 | 24 |
| 2023 | 16 | 18 |
| 2024 | 17 | 13 |
| 2025 | 20 | 16 |
| 2026 | 9 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Microfluidic devices26 May 2026US 12,636,645 B2Hewlett-Packard Development Company, L. P.
- Production method for a micromechanical sensor apparatus, and corresponding micromechanical sensor apparatus19 May 2026US 12,630,419 B2Robert Bosch GmbH
- Micromechanical component, sound transducer device, and method for producing a micromechanical component12 May 2026US 12,628,566 B2Robert Bosch GmbH
- Stress isolation for integrated circuit package integration28 Apr 2026US 12,612,303 B2Analog Devices, Inc.
- MEMS transducer device for high-frequency applications, and manufacturing method21 Apr 2026US 12,610,197 B2STMicroelectronics S,r.l.
- Asic capped mems device20 Aug 2026US 2026/0242209 A1Murata Manufacturing Co., Ltd.
- Asic capped double layer mems platform20 Aug 2026US 2026/0242213 A1Murata Manufacturing Co., Ltd.
- Semiconductor device and method of forming the same13 Aug 2026US 2026/0239881 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Mems component and method for producing a mems component23 Jul 2026US 2026/0209032 A1
- MEMS Device Having Reduced Package Size18 Jun 2026US 2026/0167481 A1InvenSense, Inc.
Most cited
By later US patents
- Heterogeneously integrated microsystem-on-a-chip337US 7,335,972 B2Sandia Corporation · 2008
- Method of fabricating vertical integrated circuits333US 6,875,671 B2Reveo, Inc. · 2005
- Vertical system integration289US 7,402,897 B2Elm Technology Corporation · 2008
- Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips273US 9,368,429 B2Intel Corporation · 2016
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016