MEMS Device Having Reduced Package Size

A method for fabricating a microelectromechanical sensor (MEMS) device, comprising:

• providing a processing layer including processing circuitry and a plurality of bond pads that each receive a processed signal from the processing circuitry;
• coupling a MEMS layer to the processing layer, the MEMS layer defining a cavity including at least one movable MEMS component;
• forming a plurality of electrical connections, each electrical connection extending from a respective one of the plurality of bond pads vertically to an upper surface of the MEMS layer;
• forming a redistribution layer on the upper surface of the MEMS layer, the redistribution layer including a plurality of conductive paths extending laterally across a horizontal portion of the MEMS layer and each of the conductive paths connected to one of the plurality of electrical connections;
• forming a plurality of solderable pads on the redistribution layer, the solderable pads defining external solderable contact points and each connected to one of the plurality of conductive paths;
• forming an overmold encapsulating the MEMS layer and the processing layer, with an upper surface of the plurality of solderable pads exposed;
• and
• planarizing an upper surface of the overmold to form a package surface for the overmold and solderable pads for direct mounting to external circuitry.

A method for fabricating a microelectromechanical sensor (MEMS) device, comprising:

• providing a processing layer including processing circuitry and a plurality of bond pads that each receive a processed signal from the processing circuitry;
• coupling a MEMS layer to the processing layer, the MEMS layer defining a cavity including at least one movable MEMS component;
• forming an overmold encapsulating the MEMS layer and the processing layer;
• forming vias through the overmold and providing access to the plurality of bond pads;
• forming a plurality of electrical connections, each electrical connection extending from a respective one of the plurality of bond pads vertically through a respective one of the vias to an upper surface of the overmold;
• forming a redistribution layer on the upper surface of the overmold, the redistribution layer including a plurality of conductive paths extending laterally across a horizontal portion of the overmold and each of the conductive paths connected to one of the plurality of electrical connections;
• and
• forming a plurality of solderable pads on the redistribution layer, the solderable pads defining external solderable contact points and each connected to one of the plurality of conductive paths.