B81C 1/00246
Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on
Official title: {Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate}
B81C1/00246 (Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on) appears on 618 US grants and 614 published applications in this corpus.
Search patents in B81C- Granted patents
- 618
- Published applications
- 614
- Assignees
- 244
- Inventors
- 1,034
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 6 | 0 |
| 1998 | 15 | 0 |
| 1999 | 6 | 0 |
| 2000 | 14 | 0 |
| 2001 | 8 | 2 |
| 2002 | 10 | 5 |
| 2003 | 10 | 11 |
| 2004 | 13 | 18 |
| 2005 | 9 | 11 |
| 2006 | 8 | 15 |
| 2007 | 14 | 17 |
| 2008 | 12 | 22 |
| 2009 | 8 | 30 |
| 2010 | 28 | 42 |
| 2011 | 26 | 49 |
| 2012 | 46 | 24 |
| 2013 | 36 | 35 |
| 2014 | 37 | 45 |
| 2015 | 37 | 45 |
| 2016 | 54 | 43 |
| 2017 | 37 | 40 |
| 2018 | 29 | 35 |
| 2019 | 32 | 26 |
| 2020 | 32 | 30 |
| 2021 | 21 | 12 |
| 2022 | 15 | 15 |
| 2023 | 12 | 11 |
| 2024 | 13 | 14 |
| 2025 | 10 | 11 |
| 2026 | 6 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Systems and methods for fabricating a 2D-material-based quantum sensor chip14 Jul 2026US 12,685,199 B2Toyota Jidosha Kabushiki Kaisha
- Foundry-compatible process for integrated micro-speaker and microphone26 May 2026US 12,641,387 B2Vibrant Microsystems Inc.
- Wafer level vacuum packaging (WLVP) of thermal imaging sensor19 May 2026US 12,631,491 B2Meridian Innovation Pte Ltd
- Foundry-compatible process for integrated micro-speaker and microphone17 Sep 2026US 2026/0281642 A1Vibrant Microsystems Inc.
- Mems microphone and mems accelerometer on a single substrate27 Aug 2026US 2026/0250120 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Microelectromechanical system20 Aug 2026US 2026/0242214 A1Murata Manufacturing Co., Ltd.
- Microelectromechanical system20 Aug 2026US 2026/0243799 A1Murata Manufacturing Co., Ltd.
- Pressure sensor manufacturing method4 Jun 2026US 2026/0152388 A1Japan Display Inc.
Most cited
By later US patents
- Vertical system integration289US 7,402,897 B2Elm Technology Corporation · 2008
- Lithography device for semiconductor circuit pattern generator287US 7,242,012 B2Elm Technology Corporation · 2007
- Fully integrated single-crystal silicon-on-insulator process, sensors and circuits261US 5,343,064 A1994
- Polycrystalline silicon germanium films for forming micro-electromechanical systems226US 6,210,988 B1The Regents of the University of California · 2001
- Method of making a digital flexure beam accelerometer216US 5,192,395 ATexas Instruments Incorporated · 1993