Silicon based condenser microphone and packaging method for the same

A method for packaging a silicon based condenser microphone, the method comprising the steps of:

• inputting a board which is mounted with a Micro Electro Mechanical System (MEMS) microphone chip and an application specific integrated circuit (ASIC) and is formed with a connecting pattern and at least one connecting terminal;
• inputting a metal case;
• aligning the metal case on the connecting pattern of the board;
• and
• welding an opened end of the metal case to the connecting pattern of the board, wherein the metal case and the connecting terminal are connected by way of the connecting pattern and the connecting terminal extends to a circumference of the board.

A silicon based condenser microphone comprising:

• a metal case having a bottom surface which is closed;
• and
• a board which is formed with a sound hole for collecting an external sound and a sealing terminal for sealing the sound hole by soldering to prevent distortion of a sound wave in the space between a main printed circuit board (PCB) and the microphone,
• the board being mounted with a Micro Electro Mechanical System (MEMS) microphone chip and an application specific integrated circuit (ASIC) chip having an electric voltage pump and a buffer IC,
• the board being formed with a connecting pattern for connecting with the metal case so that the metal case is bonded on the connecting pattern by welding;
• at least one connecting terminal connected with the connecting pattern, the connecting terminal extending to a circumference of the board.

A silicon based condenser microphone which is mounted on a main printed circuit board (PCB) having an inserting hole into which the condenser microphone is inserted and connecting pads, the condenser microphone comprising:

• a metal case which is inserted into the inserting hole of the main PCB and has a closed bottom side;
• a board which is broader than the metal case, the board being formed with a sound hole on a central portion thereof and mounted with a Micro Electro Mechanical System (MEMS) microphone chip and an application specific integrated circuit (ASIC) chip having an electric voltage pump and a buffer IC, the board being formed with a connecting pattern for bonding with the metal case so that the metal case is bonded to the connecting pattern;
• and
• connecting terminals which are formed on a part side of the board which is mounted with the metal case to connect with the connecting pads of the main PCB, the connecting terminal extending to a circumference of the board.