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US 12,581,954 B2Granted
Semiconductor device package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYing-Chung Chen, Lu-Ming Lai
Life of this patent
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Abstract
A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a protective element, and a sensor device. The protective element encapsulates the carrier. The sensor device is embedded in the carrier and the protective element. The sensor device includes a sensing portion and a protective portion adjacent to the sensing portion, and the protective portion of the sensor device has a first surface exposed from the protective element and the carrier.
Claims16
A semiconductor device package, comprising:
- a carrier having a first surface and a second surface opposite to the first surface;
- a sensor device and a first device embedded in the carrier;
- and
- a protective element encapsulating the carrier, the sensor device, and the first device, wherein the first surface of the carrier, a first surface of the sensor device, and a surface of the first device are exposed from a first surface of the protective element,
- wherein the sensor device comprises a sensing portion and a protective portion adjacent to the sensing portion, and the protective portion of the sensor device has the first surface exposed from the first surface of the protective element and the first surface of the carrier,
- wherein the first surface of the sensor device is configured to allow a light having a predetermined wavelength receivable by the sensing portion to pass through,
- wherein the protective element is configured to block the light to be received by the sensor device, and
- wherein the sensing portion comprises a sensing region disposed at a second surface of the sensor device opposite to the first surface.
5 more elements
Dependencies are inferred from the claim text.