Electronic component having micro-electrical mechanical system
AssigneeKabushiki Kaisha Toshiba
InventorMie Matsuo
Life of this patent
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Abstract
An electronic component includes a semiconductor substrate having a first surface and a second surface opposite to the first surface, a cavity that penetrates from the first surface to the second surface of the semiconductor substrate, and an electrical mechanical element that has a movable portion formed above the first surface of the semiconductor substrate so that the movable portion is arranged above the cavity. The electronic component further includes an electric conduction plug, which penetrates from the first surface to the second surface of the semiconductor substrate, and which is electrically connected to the electrical mechanical element.
Claims16
An electronic component module comprising:
- an electronic component including:
- a semiconductor substrate having a first surface and a second surface opposite to the first surface;
- a cavity that has an opening penetrating from the first surface to the second surface of the semiconductor substrate;
- an electrical mechanical element which has a movable portion, and which is formed above the first surface of the semiconductor substrate so that the movable portion is arranged above the cavity;
- and
- an electric conduction plug which penetrates from the first surface to the second surface of the semiconductor substrate and is electrically connected to the electrical mechanical element;
- and
- a circuit chip stacked on the electronic component with a spacer interposed in-between.
The electronic component module comprising:
- a circuit board including a wiring pattern;
- An electronic component including:
- a semiconductor substrate having a first surface and a second surface opposite to the first surface;
- a cavity that has an opening penetrating from the first surface to the second surface of the semiconductor substrate;
- an electrical mechanical element which has a movable portion, and which is formed above the first surface of the semiconductor substrate so that the movable portion is arranged above the cavity;
- and
- an electric conduction plug which penetrates from the first surface to the second surface of the semiconductor substrate and is electrically connected to the electrical mechanical element;
- an electric conduction bump which electrically connects the electric conduction plug of the electronic component to the wiring pattern of the circuit board, and which is arranged between the electronic component and the circuit board;
- a spacer arranged on the first surface of the semiconductor substrate where the electrical mechanical element of the electronic component is formed;
- and a circuit chip which is stacked on the electronic component with the spacer interposed in-between.
Dependencies are inferred from the claim text.