H10W 80/732
Having shape changed during the connecting
Official title: {having shape changed during the connecting}
H10W80/732 (Having shape changed during the connecting) appears on 557 US grants and 716 published applications in this corpus.
Search patents in H10W- Granted patents
- 557
- Published applications
- 716
- Assignees
- 111
- Inventors
- 890
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 2 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 1 | 1 |
| 2006 | 3 | 2 |
| 2007 | 0 | 0 |
| 2008 | 1 | 6 |
| 2009 | 0 | 0 |
| 2010 | 1 | 3 |
| 2011 | 2 | 5 |
| 2012 | 2 | 7 |
| 2013 | 6 | 5 |
| 2014 | 11 | 17 |
| 2015 | 12 | 27 |
| 2016 | 21 | 24 |
| 2017 | 24 | 26 |
| 2018 | 24 | 33 |
| 2019 | 25 | 27 |
| 2020 | 33 | 50 |
| 2021 | 49 | 118 |
| 2022 | 80 | 118 |
| 2023 | 73 | 68 |
| 2024 | 92 | 81 |
| 2025 | 65 | 57 |
| 2026 | 29 | 38 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor device and method for manufacturing same17 Sep 2026US 2026/0282505 A1
- Semiconductor module10 Sep 2026US 2026/0271787 A1Fuji Electric Co., Ltd.
- Semiconductor device structure with bonding pad and method for forming the same27 Aug 2026US 2026/0256023 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Method of room temperature covalent bonding315US 7,109,092 B2Ziptronix, Inc. · 2006
- Semiconductor device and associated fabrication method309US 5,753,536 AMatsushita Electric Industrial Co., Ltd. · 1998
- Independent 3D stacking269US 9,559,081 B1Apple Inc. · 2017
- Semiconductor structure and a manufacturing method thereof263US 9,859,254 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- Hybrid bonding mechanisms for semiconductor wafers261US 9,142,517 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015