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US 9,559,081 B1Granted
Independent 3D stacking
AssigneeApple Inc.
InventorsKwan-Yu Lai, Jun Zhai, Kunzhong Hu
Life of this patent
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Abstract
Packages and 3D die stacking processes are described. In an embodiment, a package includes a second level die hybrid bonded to a first package level including a first level die encapsulated in an oxide layer, and a plurality of through oxide vias (TOVs) extending through the oxide layer. In an embodiment, the TOVs and the first level die have a height of about 20 microns or less.
Claims19
A package comprising:
- a redistribution layer (RDL);
- a front side of a first package level on the RDL, the first package level including:
- a first level die encapsulated in a gap fill oxide layer on the RDL, wherein laterally opposite sides of the first level die are laterally surrounded by the gap fill oxide;
- and
- a plurality of through oxide vias (TOVs) that are laterally adjacent to the laterally opposite sides of first level die and extend through the gap fill oxide layer;
- wherein the TOVs and the first level die have a height of about 20 microns or less;
- and
- a second package level including a second level die hybrid bonded to a back side of the first package level, the hybrid bond including directed bonded oxide-oxide surfaces and direct bonded metal-metal surfaces.
5 more elements
A package comprising:
- a redistribution layer (RDL);
- a front side of a first package level on the RDL, the first package level including:
- a first level die encapsulated in a gap fill oxide layer on the RDL;
- and
- a plurality of through oxide vias (TOVs) extending through the gap fill oxide layer;
- wherein the TOVs and the first level die have a height of about 20 microns or less;
- and
- a second package level including a second level die hybrid bonded to a back side of the first package level, the hybrid bond including directed bonded oxide-oxide surfaces and direct bonded metal-metal surfaces, wherein the second level die is encapsulated in a molding compound on the first package level.
5 more elements
A package comprising:
- a redistribution layer (RDL);
- a front side of a first package level on a back side of the RDL, the first package level including:
- a first level die encapsulated in a gap fill oxide layer on the back side of the RDL;
- a first row of through oxide vias (TOVs) protruding from the back side of the RDL;
- a second row of through oxide vias (TOVs) protruding from the back side of the RDL;
- wherein the first level die is located laterally between the first and second rows of TOVs;
- and
- a plurality of second level die hybrid bonded to a back side of the first package level, the hybrid bond including directed bonded oxide-oxide surfaces and direct bonded metal-metal surfaces.
5 more elements
A method of forming a package comprising:
- forming a first package level on a carrier substrate, the first package level including a first level die encapsulated in a gap fill oxide layer, and a plurality of though oxide vias (TOVs), wherein the TOVs have a height of about 20 μm or less, wherein the method of forming the first package level on the carrier substrate comprises:
- attaching the first level die to the carrier substrate;
- depositing the gap fill oxide layer over the first level die;
- planarizing the gap fill oxide layer;
- and
- forming the plurality of TOVs in the gap fill oxide layer;
- hybrid bonding a second level die to the first package level, wherein the hybrid bond includes direct bonded oxide-oxide surfaces and metal-metal surfaces;
- encapsulating the second level die on a back side of the first package level;
- removing the carrier substrate;
- and
- forming a redistribution layer (RDL) on a front side of the first package level.
8 more elements
Dependencies are inferred from the claim text.