Semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorTomofumi OOSE
Life of this patent
Estimating the term…
Abstract
Provided is a semiconductor module including a main circuit portion, a plurality of circuit electrodes, a plurality of main terminals, and a plurality of wires, in each of semiconductor chips, transistor portions and diode portions have a longitudinal side in a second direction, each of semiconductor chips has a plurality of end sides including a gate-side end side, each of the gate-side end sides is arranged facing a same side in a top view, the plurality of main terminals are arranged on a same side in relation to the main circuit portion so as not to sandwich the main circuit portion in a top view, each of the plurality of wires has a bonding portion, and a longitudinal direction of the bonding portion has an angle in relation to the second direction.
Claims21
A semiconductor module comprising:
- a main circuit portion in which semiconductor chips are arrayed and arranged along a first direction, each of the semiconductor chips including transistor portions and diode portions and having a gate electrode pad and a main electrode provided on an upper surface thereof, wherein the main electrode extends over the transistor portions and the diode portions thereof;
- a circuit electrode portion in which a plurality of circuit electrodes are electrically connected to the main electrodes of a plurality of the semiconductor chips;
- a main terminal portion in which a plurality of main terminals are electrically connected to the plurality of circuit electrodes;
- a control circuit portion electrically connected to the gate electrode pad of each of the semiconductor chips;
- a plurality of first wires;
- and
- a plurality of second wires, wherein
- in each of the semiconductor chips, the transistor portions and the diode portions have longitudinal sides in a second direction, and also the transistor portions and the diode portions are alternately arranged in a third direction perpendicular to the second direction,
- each of the semiconductor chips has a plurality of end sides including a gate-side end side with a closest distance to the gate electrode pad in a top view and a main terminal-side end side facing the gate side end side in the top view,
- the control circuit portion, the main circuit portion, the circuit electrode portion, and the main terminal portion are arranged in this order,
- each of the first wires connecting each of the main electrodes of the plurality of the semiconductor chips and the plurality of circuit electrodes to each other,
- each of the second wires connecting the gate electrode pad of the plurality of the semiconductor chips and the control circuit portion to each other through the gate-side end side of each of the semiconductor chips in a top view,
- each of the plurality of first wires has a bonding portion connected to the main electrode of a corresponding one of the plurality of the semiconductor chips,
- each of the bonding portions has a longitudinal direction in a top view, and
- each of the bonding portions overlaps at least a part of one of the transistor portions and at least a part of one of the diode portions in a top view.
Dependencies are inferred from the claim text.