H10W 80/335
Ultrasonic bonding
Official title: {Ultrasonic bonding}
H10W80/335 (Ultrasonic bonding) appears on 49 US grants and 65 published applications in this corpus.
Search patents in H10W- Granted patents
- 49
- Published applications
- 65
- Assignees
- 38
- Inventors
- 122
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 1 | 0 |
| 2008 | 0 | 2 |
| 2009 | 1 | 0 |
| 2010 | 0 | 2 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 2 |
| 2014 | 2 | 3 |
| 2015 | 2 | 4 |
| 2016 | 3 | 1 |
| 2017 | 1 | 1 |
| 2018 | 3 | 6 |
| 2019 | 3 | 8 |
| 2020 | 7 | 8 |
| 2021 | 6 | 7 |
| 2022 | 3 | 2 |
| 2023 | 4 | 6 |
| 2024 | 2 | 3 |
| 2025 | 4 | 4 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding apparatus and bonding method using the same26 May 2026US 12,642,134 B2Samsung Display Co., Ltd.
- Semiconductor package and manufacturing method thereof12 May 2026US 12,628,710 B2Nanya Technology Corporation
- Semiconductor device10 Jun 2025US 12,327,808 B2Hitachi Power Semiconductor Device, Ltd.
- Method for manufacturing display device and display device manufacturing apparatus15 Apr 2025US 12,278,223 B2Semiconductor Energy Laboratory Co.Ltd.
- Packaged device including an optical path structure aligned to an optical feature11 Mar 2025US 12,248,178 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package and manufacturing method thereof20 Aug 2026US 2026/0248050 A1Nanya Technology Corporation
- Method of manufacturing an electronic device5 Mar 2026US 2026/0068731 A1STMicroelectronics International N. V.
- Method For Manufacturing Display Device and Display Device Manufacturing Apparatus15 May 2025US 2025/0158000 A1Semiconductor Energy Laboratory Co.Ltd.
- Heterogeneous chip stacking structure27 Mar 2025US 2025/0105186 A1Shine Optics Technology Company Limited
- Heterogeneous chip stacking device27 Mar 2025US 2025/0105202 A1Shine Optics Technology Company Limited
Most cited
By later US patents
- Methods for providing void-free layers for semiconductor assemblies104US 5,834,339 ATessera, Inc. · 1998
- Methods for providing void-free layers for semiconductor assemblies37US 6,107,123 ATessera, Inc. · 2000
- Method for providing void free layer for semiconductor assemblies33US 6,458,681 B1Tessera, Inc. · 2002
- Methods for providing void-free layers for semiconductor assemblies29US 6,780,747 B2Tessera, Inc. · 2004
- Methods for providing void-free layers for semiconductor assemblies27US 6,653,172 B2Tessera, Inc. · 2003