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US 12,248,178 B2Granted
Packaged device including an optical path structure aligned to an optical feature
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Ming-Fa Chen
Life of this patent
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Abstract
A packaged device includes an optical IC having an optical feature therein. An interconnect structure including layers of conductive features embedded within respective layers of dielectric materials overlie the optical feature. The interconnect structure is patterned to remove the interconnect structure from over the optical feature and a dielectric material having optically neutral properties, relative to a desired light wavelength(s) is formed over the optical feature. One or more electronic ICs may be bonded to the optical IC to form an integrated package.
Claims20
A device comprising:
- an optical integrated circuit including:
- a silicon on insulator substrate;
- a through substrate via (TSV) extending through a back side of the silicon on the insulator substrate;
- an optical feature formed at a top side of the substrate;
- and
- an interconnect structure formed over the top side of the substrate, the interconnect structure providing electrical connection to electrical components of the optical integrated circuit;
- an electronic integrated circuit bonded to the optical integrated circuit by way of a bond interface, the bond interface including a first dielectric layer fusion bonded to a second dielectric layer and a first metal pad metal-to-metal bonded to a second metal pad;
- and
- an optical path structure aligned to the optical feature, the optical path structure comprising a dielectric material that surrounds the electronic integrated circuit, the dielectric material extending to a topmost surface of the device, an integral portion of the optical path structure extending through the interconnect structure and through the first dielectric layer, and being free of optical interfaces from a top surface of the first dielectric layer to a bottom surface of the interconnect structure.
6 more elements
A device comprising:
- an optical integrated circuit including a substrate, and an optical feature formed at a top side of the substrate;
- an interconnect structure formed over the top side of the substrate, the interconnect structure including a first bonding dielectric layer and first bonding pads embedded within and co-planar with the first bonding dielectric layer;
- an electronic integrated circuit including a second bonding dielectric layer, the second bonding dielectric layer forming a fusion bond interface with the first bonding dielectric layer, and second bonding pads embedded within and co-planar with the second bonding dielectric layer, respective second bonding pads forming respective metal-to-metal interfaces with respective first bonding pads;
- and
- an optical path structure aligned to the optical feature, the optical path structure comprising dielectric material that surrounds the electronic integrated circuit and that is transparent to a desired wavelength of light, the optical path structure being free of optical interfaces from a top surface of the first bonding dielectric layer to the bottommost surface of the interconnect structure.
2 more elements
A device comprising:
- an optical integrated circuit having an optical feature on a top surface thereof;
- a first bonding dielectric layer on the top surface of the optical integrated circuit;
- first metal bonding pads embedded in and co-planar with the first bonding dielectric layer;
- an electronic integrated circuit on the optical integrated circuit, the electronic integrated circuit including
- a second bonding dielectric layer forming a fusion bond interface with the first bonding dielectric layer, and
- second metal bonding pads embedded in and co-planar with the second bonding dielectric layer, respective second metal bonding pads forming respective metal-to-metal interfaces with respective first metal bonding pads;
- and
- an optical path structure extending from a topmost surface of the electronic integrated circuit through to the optical feature, the optical path structure defined at least in part by a pathway dielectric material that extends above the fusion bond interface and that is surrounded by and forms an interface with a passivation layer, the passivation layer further surrounding the electronic integrated circuit.
5 more elements
Dependencies are inferred from the claim text.