Method for providing void free layer for semiconductor assemblies
AssigneeTessera, Inc.
InventorsThomas H. DiStefano, Joseph Fjelstad
Life of this patent
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Abstract
A method of providing a substantially void free layer for one or more flip chip assemblies, or one or more microelectronic components, utilizing a curable encapsulant. Also disclosed is a method of injecting an encapsulant into an assembly and a method of treating a microelectronic component to form a void free layer.
Claims18
A method of providing a substantially void free underfill for a flip chip assembly, comprising:
- electrically connecting a plurality of contact pads on a surface of a semiconductor chip to corresponding bond pads on a circuitized substrate such that the connections create a gap between the chip and the substrate, wherein the substrate is rigid;
- sealing the gap between the chip and the substrate with a fluid, curable encapsulant so that there is a void therebetween;
- applying pressure to the assembly causing the encapsulant to flow into the gap and around the connections;
- and
- applying energy to the assembly in order to cure the encapsulant.
A method of injecting an encapsulant between a face surface of a semiconductor chip and a juxtaposed substrate, comprising:
- providing a gap between the face surface of the chip and the substrate, wherein the substrate is rigid;
- sealing each edge of the gap with a curable fluid encapsulant so that there is a void between the chip and the substrate;
- applying pressure to cause the encapsulant to flow between the chip and the substrate;
- and
- applying energy to cure the encapsulant.
A method of providing a substantially void free underfill for a semiconductor wafer having a plurality of flip chip assemblies, comprising:
- electrically connecting a plurality of contact pads of flip chip assemblies disposed on a surface of a semiconductor wafer to corresponding bond pads on a circuitized substrate such that the connections create a gap between the flip chip assemblies and the substrate, wherein the substrate is rigid;
- sealing the gap between the flip chip assemblies and the substrate with a fluid, curable encapsulant so that there is a void therebetween;
- applying pressure to cause the encapsulant to flow into the gap and around the connections;
- and
- applying energy to cure the encapsulant.
A method of injecting an encapsulant between a face surface of a semiconductor wafer and a juxtaposed substrate, comprising:
- providing a gap between the face surface of the wafer and the substrate, wherein the substrate is rigid;
- sealing each edge of the gap with a curable fluid encapsulant so that there is a void between the wafer and the substrate;
- applying pressure to cause the encapsulant to flow between the wafer and the substrate;
- and
- applying energy to cure the encapsulant.
Dependencies are inferred from the claim text.