Semiconductor package and manufacturing method thereof
AssigneeNanya Technology Corporation
InventorWu-Der YANG
Life of this patent
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Abstract
The present disclosure is related to a semiconductor package. The semiconductor package includes a substrate and a semiconductor chip. The substrate includes a window through a center portion of the substrate, in which the substrate has an inner sidewall surrounding the window and a conductive foil located on a top surface of the substrate, in which the conductive foil extends beyond the inner sidewall of the substrate. The semiconductor chip is located on the top surface of the substrate, in which the conductive foil is located between the substrate and the semiconductor chip, and the semiconductor chip has a bonding pad electrically connected to the conductive foil.
Claims15
A manufacturing method of a semiconductor package, comprising:
- forming a window through a center portion of a substrate, such that the substrate has an inner sidewall surrounds the window, wherein the substrate has a conductive foil located on a first surface of the substrate and extending beyond the inner sidewall of the substrate;
- attaching the substrate to a first surface of a semiconductor chip such that the conductive foil is located between the substrate and the semiconductor chip;
- and
- soldering the conductive foil of the substrate to a bonding pad of the semiconductor chip such that the bonding pad of the semiconductor chip is electrically connected to the conductive foil.
A manufacturing method of a semiconductor package, comprising:
- forming a window through a center portion of a substrate, such that the substrate has an inner sidewall surrounds the window, wherein the substrate has a conductive foil located on a first surface of the substrate and extending beyond the inner sidewall of the substrate;
- attaching the substrate to a first surface of a semiconductor chip;
- soldering the conductive foil of the substrate to a bonding pad of the semiconductor chip;
- and
- forming a first portion of a molding compound on the first surface of the substrate and a second portion of the molding compound in the window of the substrate, wherein the first portion of the molding compound surrounds the semiconductor chip and covers the semiconductor chip, and the second portion of the molding compound extends to a second surface of the substrate opposite the first surface of the substrate.
Dependencies are inferred from the claim text.