H10W 80/334
Thermocompression bonding
Official title: {Thermocompression bonding}
H10W80/334 (Thermocompression bonding) appears on 401 US grants and 518 published applications in this corpus.
Search patents in H10W- Granted patents
- 401
- Published applications
- 518
- Assignees
- 130
- Inventors
- 752
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 2 |
| 2003 | 1 | 1 |
| 2004 | 1 | 1 |
| 2005 | 0 | 2 |
| 2006 | 1 | 2 |
| 2007 | 1 | 0 |
| 2008 | 1 | 1 |
| 2009 | 1 | 1 |
| 2010 | 0 | 4 |
| 2011 | 1 | 0 |
| 2012 | 1 | 11 |
| 2013 | 10 | 17 |
| 2014 | 16 | 21 |
| 2015 | 19 | 28 |
| 2016 | 15 | 23 |
| 2017 | 35 | 19 |
| 2018 | 20 | 25 |
| 2019 | 22 | 26 |
| 2020 | 31 | 45 |
| 2021 | 32 | 50 |
| 2022 | 39 | 55 |
| 2023 | 39 | 57 |
| 2024 | 48 | 48 |
| 2025 | 44 | 41 |
| 2026 | 20 | 38 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and method of manufacturing the same6 Oct 2026US 12,757,790 B2Samsung Electronics Co., Ltd.
- Semiconductor package and method of manufacturing the semiconductor package15 Sep 2026US 12,740,485 B2Samsung Electronics Co., Ltd.
- Integrated circuit packages and methods of forming the same25 Aug 2026US 12,721,194 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices18 Aug 2026US 12,713,952 B2Amkor Technology Singapore Holding Pte.Ltd.
- System and method for fluxless thermocompression bonding4 Aug 2026US 12,702,038 B2Asmpt Singapore Pte. Ltd.
- Package structure and method for fabricating the same8 Oct 2026US 2026/0314354 A1National Yang Ming.Chiao Tung University
- Rfsoi semiconductor structures including an electromagnetic shield layer and methods of manufacturing the same1 Oct 2026US 2026/0305359 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate layered body producing method and substrate layered body1 Oct 2026US 2026/0305462 A1Mitsui Chemicals, Inc.
- Method for manufacturing semiconductor device, and curable resin composition1 Oct 2026US 2026/0305463 A1Resonac Corporation
- Method for manufacturing substrate laminate3 Sep 2026US 2026/0262539 A1Mitsui Chemicals, Inc.
Most cited
By later US patents
- Hybrid bonding mechanisms for semiconductor wafers261US 9,142,517 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafers256US 8,809,123 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014
- Process for realizing a connecting structure242US 9,224,704 B2Soitec · 2015
- Low temperature bonded structures178US 10,790,262 B2Invensas Bonding Technologies, Inc. · 2020
- Molded direct bonded and interconnected stack173US 11,158,606 B2Invensas Bonding Technologies, Inc. · 2021