H10W 80/161
Aligning
Official title: {Aligning}
H10W80/161 (Aligning) appears on 391 US grants and 527 published applications in this corpus.
Search patents in H10W- Granted patents
- 391
- Published applications
- 527
- Assignees
- 136
- Inventors
- 881
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 4 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 2 |
| 2003 | 1 | 3 |
| 2004 | 1 | 3 |
| 2005 | 0 | 1 |
| 2006 | 1 | 2 |
| 2007 | 2 | 1 |
| 2008 | 1 | 0 |
| 2009 | 5 | 5 |
| 2010 | 1 | 4 |
| 2011 | 4 | 4 |
| 2012 | 1 | 7 |
| 2013 | 5 | 7 |
| 2014 | 10 | 14 |
| 2015 | 14 | 22 |
| 2016 | 10 | 11 |
| 2017 | 22 | 17 |
| 2018 | 17 | 28 |
| 2019 | 23 | 30 |
| 2020 | 32 | 51 |
| 2021 | 41 | 56 |
| 2022 | 40 | 48 |
| 2023 | 41 | 69 |
| 2024 | 41 | 38 |
| 2025 | 44 | 57 |
| 2026 | 21 | 47 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor integrated circuit, semiconductor device and method for aligning semiconductor integrated circuits15 Sep 2026US 12,740,433 B2Macronix International Co., Ltd.
- Method of assembly by direct bonding of electronic components25 Aug 2026US 12,721,248 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Semiconductor device including joint portion between conductive connection structures and method of fabricating the same18 Aug 2026US 12,713,975 B2SK hynix Inc.
- Wafer bonding method and bonded device structure28 Jul 2026US 12,696,768 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Bonding method30 Jun 2026US 12,672,574 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing semiconductor device, and semiconductor device1 Oct 2026US 2026/0304908 A1Resonac Corporation
- Method for manufacturing semiconductor device, and semiconductor device1 Oct 2026US 2026/0305500 A1Resonac Corporation
- Method for forming semiconductor device24 Sep 2026US 2026/0293679 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package method and package system17 Sep 2026US 2026/0282788 A1CXMT Corporation
- Stacked die memory sparing device and method17 Sep 2026US 2026/0282847 A1Micron Technology, Inc.
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Methods and devices for fabricating and assembling printable semiconductor elements382US 7,982,296 B2The Board of Trustees of the University of Illinois · 2011
- Substrate for packaging a semiconductor device370US 5,214,308 ASumitomo Electric Industries, Ltd. · 1993
- Methods and devices for fabricating and assembling printable semiconductor elements341US 8,440,546 B2The Board of Trustees of the University of Illinois · 2013