H10W 80/163
Using active alignment
Official title: {using active alignment, e.g. detecting marks and correcting position}
H10W80/163 (Using active alignment) appears on 256 US grants and 355 published applications in this corpus.
Search patents in H10W- Granted patents
- 256
- Published applications
- 355
- Assignees
- 91
- Inventors
- 579
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 2 | 1 |
| 2010 | 0 | 1 |
| 2011 | 2 | 2 |
| 2012 | 0 | 6 |
| 2013 | 5 | 4 |
| 2014 | 5 | 7 |
| 2015 | 8 | 13 |
| 2016 | 5 | 10 |
| 2017 | 17 | 14 |
| 2018 | 14 | 21 |
| 2019 | 17 | 19 |
| 2020 | 22 | 38 |
| 2021 | 29 | 37 |
| 2022 | 23 | 36 |
| 2023 | 34 | 46 |
| 2024 | 28 | 28 |
| 2025 | 30 | 39 |
| 2026 | 14 | 32 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor integrated circuit, semiconductor device and method for aligning semiconductor integrated circuits15 Sep 2026US 12,740,433 B2Macronix International Co., Ltd.
- Wafer bonding method and bonded device structure28 Jul 2026US 12,696,768 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Bonding method30 Jun 2026US 12,672,574 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device, method of manufacturing semiconductor device, and method of disposing alignment mark23 Jun 2026US 12,666,973 B2Kioxia Corporation
- Semiconductor device and method for forming the same26 May 2026US 12,642,096 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing semiconductor device, and semiconductor device1 Oct 2026US 2026/0305500 A1Resonac Corporation
- Method for forming semiconductor device24 Sep 2026US 2026/0293679 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package method and package system17 Sep 2026US 2026/0282788 A1CXMT Corporation
- Stacked die memory sparing device and method17 Sep 2026US 2026/0282847 A1Micron Technology, Inc.
- Die bonding system including alignment and bonding actuators and a method of using the same17 Sep 2026US 2026/0282987 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Methods and devices for fabricating and assembling printable semiconductor elements382US 7,982,296 B2The Board of Trustees of the University of Illinois · 2011
- Methods and devices for fabricating and assembling printable semiconductor elements341US 8,440,546 B2The Board of Trustees of the University of Illinois · 2013
- Methods and devices for fabricating and assembling printable semiconductor elements327US 8,664,699 B2The Board of Trustees of the University of Illinois · 2014