H10W 80/168
Using guiding structures
Official title: {using guiding structures}
H10W80/168 (Using guiding structures) appears on 97 US grants and 103 published applications in this corpus.
Search patents in H10W- Granted patents
- 97
- Published applications
- 103
- Assignees
- 58
- Inventors
- 182
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 4 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 2 |
| 2003 | 1 | 3 |
| 2004 | 1 | 2 |
| 2005 | 0 | 1 |
| 2006 | 1 | 1 |
| 2007 | 2 | 1 |
| 2008 | 1 | 0 |
| 2009 | 3 | 4 |
| 2010 | 1 | 1 |
| 2011 | 2 | 0 |
| 2012 | 1 | 1 |
| 2013 | 0 | 3 |
| 2014 | 5 | 6 |
| 2015 | 4 | 6 |
| 2016 | 0 | 1 |
| 2017 | 4 | 4 |
| 2018 | 4 | 5 |
| 2019 | 9 | 5 |
| 2020 | 3 | 6 |
| 2021 | 6 | 12 |
| 2022 | 12 | 12 |
| 2023 | 4 | 11 |
| 2024 | 8 | 3 |
| 2025 | 8 | 7 |
| 2026 | 4 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Method for manufacturing semiconductor device, and semiconductor device1 Oct 2026US 2026/0304908 A1Resonac Corporation
- System including at least two different types of flexures17 Sep 2026US 2026/0282986 A1Canon Kabushiki Kaisha
- Semiconductor device and method of manufacturing the same3 Sep 2026US 2026/0262506 A1Kioxia Corporation
- Methods for low temperature bonding using nanoparticles30 Jul 2026US 2026/0223715 A1Adeia Semiconductor Technologies LLC
- Package structure16 Apr 2026US 2026/0107755 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Substrate for packaging a semiconductor device370US 5,214,308 ASumitomo Electric Industries, Ltd. · 1993
- Semiconductor device and associated fabrication method309US 5,753,536 AMatsushita Electric Industrial Co., Ltd. · 1998
- Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate256US 6,107,109 AMicron Technology, Inc. · 2000
- Bonding surfaces for direct bonding of semiconductor structures241US 8,697,493 B2Soitec · 2014
- Semiconductor interconnect having laser machined contacts223US 6,294,837 B1Micron Technology, Inc. · 2001