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US 12,598,999 B2Granted
Multi-chip die alignment
AssigneeInternational Business Machines Corporation
InventorEffendi Leobandung
Life of this patent
Estimating the term…
Abstract
Aspects of the present invention provide a semiconductor structure. The semiconductor structure may include a substrate having a first substrate alignment structure. The semiconductor structure may also include a first die with a first die alignment structure. The first die may be attached to the substrate with the first substrate alignment structure matched to the first die alignment structure.
Claims10
A semiconductor structure, comprising:
- a substrate comprising a first substrate alignment structure comprising an angled wall;
- a first die comprising a first die alignment structure, wherein the first die is attached to the substrate with the first substrate alignment structure, and the first die alignment structure comprises a crystallographic plane matched to the angled wall of the first substrate alignment structure;
- a second die comprising a second die alignment structure, wherein the substrate comprises a second substrate alignment structure, and wherein the second die is attached to the substrate with the second substrate alignment structure matched to the second die alignment structure and unmatched with the first die alignment structure;
- and
- patterned wiring above and electrically coupled to the first die and the second die, wherein the first die directly contacts the patterned wiring and the second die is covered by a dielectric fill layer.
2 more elements
A semiconductor structure, comprising:
- a substrate comprising first substrate alignment structures comprising a first angled wall and second substrate alignment structures comprising a second angled wall, wherein the second angled wall is at a different angle than the first angled wall;
- a first set of dies comprising first die alignment structures, wherein the first set of dies are attached to the substrate with the first die alignment structures comprising a crystallographic plane matched to the first angled wall;
- a second set of dies comprising second die alignment structures, wherein the second set of dies is attached to the substrate with the second die alignment structures comprising a crystallographic plane matched to the second angled wall;
- and
- patterned wiring above and electrically coupled to the first set of dies and the second set of dies, wherein the first set of dies directly contact the patterned wiring and the second set of dies is covered by a dielectric fill.
2 more elements
Dependencies are inferred from the claim text.