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US 12,506,085 B2Granted
HBI die architecture with fiducial in street for no metal depopulation in active die
AssigneeIntel Corporation
InventorsOmkar Karhade, Nitin A. Deshpande
Life of this patent
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Abstract
Embodiments disclosed herein include semiconductor devices. In one embodiment, a die comprises a substrate, where the substrate comprises a semiconductor material. In an embodiment, a backend layer is over the substrate, where the backend layer comprises conductive routing. In an embodiment, the die further comprises a protrusion extending out from an edge of the substrate and the backend layer. In an embodiment, a fiducial is on a surface of the protrusion.
Claims20
A die, comprising:
- a substrate having a first surface opposite a second surface, and a plurality of edges between the first surface and the second surface, wherein the substrate comprises a semiconductor material;
- a backend layer over the first surface of the substrate, wherein the backend layer comprises conductive routing;
- a protrusion extending laterally out from an edge of the plurality of edges of the substrate and the backend layer;
- and
- a fiducial on a surface of the protrusion.
2 more elements
An electronic package, comprising:
- a first die having a first surface opposite a second surface, and a plurality of edges between the first surface and the second surface;
- a protrusion extending laterally out from an edge of the plurality of edges of the first die;
- a first fiducial on the protrusion;
- a second die bonded to the first die;
- and
- a second fiducial on the second die, wherein the first fiducial at least partially overlaps the second fiducial.
3 more elements
An electronic system, comprising:
- a board;
- a package substrate coupled to the board;
- a first die on the package substrate;
- and
- a second die coupled to the first die, wherein the second die comprises:
- a first surface opposite a second surface, and a plurality of edges between the first surface and the second surface;
- a protrusion that extends laterally out from an edge of the plurality of edges at a corner of the second die;
- and
- a fiducial on the protrusion, wherein the fiducial is outside of a shadow of an active die region of the second die.
6 more elements
Dependencies are inferred from the claim text.