H10W 72/07236
Soldering or alloying
Official title: {Soldering or alloying}
H10W72/07236 (Soldering or alloying) appears on 8,553 US grants and 9,239 published applications in this corpus.
Search patents in H10W- Granted patents
- 8,553
- Published applications
- 9,239
- Assignees
- 1,305
- Inventors
- 11,439
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 9 | 0 |
| 1978 | 6 | 0 |
| 1979 | 8 | 0 |
| 1980 | 7 | 0 |
| 1981 | 10 | 0 |
| 1982 | 3 | 0 |
| 1983 | 6 | 0 |
| 1984 | 4 | 0 |
| 1985 | 4 | 0 |
| 1986 | 4 | 0 |
| 1987 | 12 | 0 |
| 1988 | 11 | 0 |
| 1989 | 17 | 0 |
| 1990 | 21 | 0 |
| 1991 | 29 | 0 |
| 1992 | 33 | 0 |
| 1993 | 44 | 0 |
| 1994 | 64 | 0 |
| 1995 | 47 | 0 |
| 1996 | 52 | 0 |
| 1997 | 67 | 0 |
| 1998 | 105 | 0 |
| 1999 | 122 | 0 |
| 2000 | 145 | 0 |
| 2001 | 174 | 66 |
| 2002 | 154 | 197 |
| 2003 | 188 | 192 |
| 2004 | 152 | 263 |
| 2005 | 177 | 328 |
| 2006 | 213 | 334 |
| 2007 | 187 | 365 |
| 2008 | 193 | 342 |
| 2009 | 199 | 333 |
| 2010 | 281 | 290 |
| 2011 | 277 | 328 |
| 2012 | 273 | 316 |
| 2013 | 293 | 400 |
| 2014 | 356 | 418 |
| 2015 | 390 | 526 |
| 2016 | 454 | 462 |
| 2017 | 501 | 457 |
| 2018 | 429 | 388 |
| 2019 | 395 | 474 |
| 2020 | 443 | 530 |
| 2021 | 399 | 520 |
| 2022 | 418 | 506 |
| 2023 | 404 | 338 |
| 2024 | 366 | 353 |
| 2025 | 285 | 272 |
| 2026 | 113 | 241 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring board, semiconductor device, and method for manufacturing semiconductor device6 Oct 2026US 12,757,762 B2Kioxia Corporation
- Package structure with wettable side surface and manufacturing method thereof, and vertical package module6 Oct 2026US 12,757,784 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Direct hybrid bond pad having tapered sidewall29 Sep 2026US 12,751,328 B2Adeia Semiconductor Bonding Technologies Inc.
- Display device including a light emitting element connected to a first pad electrode and a second pad electrode and manufacturing method thereof22 Sep 2026US 12,745,458 B2Samsung Display Co., Ltd.
- Microelectronics package with hybrid connection to a substrate to enable reuse8 Oct 2026US 2026/0314461 A1NXP B. V.
- Semiconductor package including connection bump8 Oct 2026US 2026/0314471 A1Samsung Electronics Co., Ltd.
- Semiconductor Device and Method of Forming Fan-Out Wafer Level CPO with Through Silicon Conductive Via1 Oct 2026US 2026/0299219 A1STATS ChipPAC Pte. Ltd.
- Double sided multi chip for leaded package1 Oct 2026US 2026/0305380 A1
- Package-on-package device1 Oct 2026US 2026/0305390 A1QUALCOMM Incorporated
Most cited
By later US patents
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices775US 7,157,787 B2Intel Corporation · 2007
- Semiconductor chip assemblies with fan-in leads734US 5,148,265 AIST Associates, Inc. · 1992
- Semiconductor chip assemblies having interposer and flexible lead719US 5,148,266 AIST Associates, Inc. · 1992