Package-on-package device

A packaged device comprising:

• a first substrate having first contacts on a first side of the first substrate and package contacts coupled to a second side of the first substrate;
• a second substrate having a plurality of component contacts coupled to a first side of the second substrate and second contacts on a second side of the second substrate, the component contacts electrically coupled to the second contacts;
• a set of interconnects positioned between the first substrate and the second substrate, the set of interconnects configured to electrically couple the first contacts of the first substrate and the second contacts of the second substrate;
• a first die electrically coupled to a first set of contacts of the first contacts on the first side of the first substrate;
• a mold compound on the first side of the second substrate, wherein the mold compound at least partially encapsulates the second substrate;
• a plurality of conductive connectors disposed within the mold compound and electrically coupled to the plurality of component contacts coupled to the first side of the second substrate;
• and
• a second die electrically coupled to the first die through the plurality of component contacts, wherein the first die is interposed between the second die and the first substrate.

A method of fabrication comprising:

• obtaining a first substrate having first contacts on a first side of the first substrate and package contacts coupled to a second side of the first substrate, wherein a first die is electrically coupled to a first set of contacts of the first contacts on the first side of the first substrate;
• obtaining a second substrate having a plurality of component contacts coupled to a first side of the second substrate and second contacts on a second side of the second substrate, the component contacts electrically coupled to the second contacts;
• electrically coupling a set of interconnects to the first contacts of the first substrate and the second contacts of the second substrate;
• electrically coupling a plurality of conductive connectors to the plurality of component contacts coupled to the first side of the second substrate;
• depositing a mold compound on the second substrate and the plurality of conductive connectors;
• and
• forming a contact channel in the mold compound to expose a surface of at least one conductive connector of the plurality of conductive connectors.