H10W 72/07234
Using a reflow oven
Official title: {Using a reflow oven}
H10W72/07234 (Using a reflow oven) appears on 781 US grants and 941 published applications in this corpus.
Search patents in H10W- Granted patents
- 781
- Published applications
- 941
- Assignees
- 288
- Inventors
- 1,537
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 3 | 2 |
| 2002 | 7 | 15 |
| 2003 | 13 | 12 |
| 2004 | 19 | 59 |
| 2005 | 26 | 50 |
| 2006 | 41 | 95 |
| 2007 | 50 | 114 |
| 2008 | 51 | 84 |
| 2009 | 49 | 60 |
| 2010 | 87 | 43 |
| 2011 | 56 | 39 |
| 2012 | 39 | 36 |
| 2013 | 32 | 29 |
| 2014 | 33 | 38 |
| 2015 | 34 | 39 |
| 2016 | 27 | 30 |
| 2017 | 30 | 27 |
| 2018 | 33 | 27 |
| 2019 | 20 | 17 |
| 2020 | 21 | 22 |
| 2021 | 20 | 37 |
| 2022 | 27 | 19 |
| 2023 | 17 | 11 |
| 2024 | 13 | 18 |
| 2025 | 10 | 14 |
| 2026 | 10 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer alignment assembly of the solder reflow system29 Sep 2026US 12,751,247 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing an interposer product15 Sep 2026US 12,740,435 B2Murata Manufacturing Co., Ltd.
- Solder reflow apparatus and method of manufacturing electronic device25 Aug 2026US 12,721,205 B2Samsung Electronics Co., Ltd.
- Semiconductor package and manufacturing method therefor11 Aug 2026US 12,708,031 B2LG Innotek Co., Ltd.
- Chip-scale package architectures containing a die back side metal and a solder thermal interface material12 May 2026US 12,628,645 B2Intel Corporation
- Vertical interconnect bridges for semiconductor device assemblies20 Aug 2026US 2026/0247998 A1Micron Technology, Inc.
- Process Chamber with UV Irradiance30 Jul 2026US 2026/0216806 A1Yield Engineering Systems, Inc.
- Heat transfer coupler that includes a cavity2 Jul 2026US 2026/0191070 A1Intel Corporation
- Chip stack package and manufacturing method of the chip stack package21 May 2026US 2026/0144147 A1SK hynix Inc.
- Semiconductor processing tool and methods of operation27 Nov 2025US 2025/0364480 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Process of fabricating three-dimensional semiconductor device576US 4,612,083 ANEC Corporation · 1986
- Method for manufacturing wafer level chip stack package329US 7,151,009 B2Samsung Electronics Co., Ltd. · 2006
- Backside method for fabricating semiconductor components with conductive interconnects311US 7,393,770 B2Micron Technology, Inc. · 2008
- Room temperature metal direct bonding236US 8,524,533 B2Ziptronix, Inc. · 2013
- Method of forming a thin wafer stack for a wafer level package232US 7,494,845 B2Samsung Electronics Co., Ltd. · 2009