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US 2026/0144147 A1Published application
Chip stack package and manufacturing method of the chip stack package
AssigneeSK hynix Inc.
InventorsWan Choon PARK, Jung Hwa LIM, Min Ju JANG, Ho Young SON
Life of this patent
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Abstract
Embodiments of the present disclosure provide a chip stack package including a first semiconductor chip having a front bump on a first surface, a second semiconductor chip stacked on a second surface of the first semiconductor chip opposite the first surface, a carrier bump bonded to the front bump, a mold member surrounding the first semiconductor chip, the second semiconductor chip, and the carrier bump, and an external connection bump disposed on the carrier bump.
Claims20
A chip stack package comprising:
- a first semiconductor chip having a front bump on a first surface of the first semiconductor chip;
- a second semiconductor chip stacked on a second surface of the first semiconductor chip opposite the first surface;
- a carrier bump bonded to the front bump;
- a mold member surrounding the first semiconductor chip and the second chip, and the carrier bump;
- and
- an external connection bump disposed on the carrier bump.
3 more elements
A chip stack package comprising:
- a base die having a front bump on a first surface;
- a core middle die stacked on a second surface of the base die opposite to the first surface;
- a core top die stacked on the core middle die;
- a carrier bump bonded to the front bump;
- a mold member surrounding the base die, the core middle die, the core top die, and the carrier bump;
- and
- an external connection bump disposed on the carrier bump.
4 more elements
A manufacturing method of a chip stack package comprising:
- forming a carrier bump on a carrier substrate;
- stacking a first semiconductor chip having a front bump on the carrier substrate and bonding the front bump to the carrier bump;
- stacking a second semiconductor chip on the first semiconductor chip;
- forming a mold member surrounding the first semiconductor chip, the second chip, and the carrier bump on the carrier substrate;
- removing the carrier substrate;
- and
- forming an external connection bump on the carrier bump exposed by removing the carrier substrate.
4 more elements
Dependencies are inferred from the claim text.