Heat transfer coupler that includes a cavity

A device comprising:

• a body comprising a solid material;
• a cavity on a first side of the body;
• one or more first channels on a second side of the body, wherein the first side of the body is opposite the second side of the body, wherein the one or more first channels allow a semiconductor chip to be reversibly attached to the second side of the body through application of a vacuum to the one or more first channels;
• and
• one or more second channels wherein the one or more second channels are operably coupled to the one or more first channels and are capable of supplying a vacuum to the one or more second channels, wherein the one or more second channels are in the body, and wherein the one or more second channels are open to a surface of the body.

A method comprising:

• placing a substrate and a semiconductor chip that are to be electrically coupled in a manufacturing tool wherein the manufacturing tool comprises:
• a heater, and
• a heat transfer coupler comprising a first face and a second face, wherein the first face is opposite the second face, wherein the heat transfer coupler comprises a cavity in the first face, wherein the heat transfer coupler comprises first channels in the second face, wherein the heater is capable of supplying heat to the first face of the heat transfer coupler, and wherein a semiconductor chip is attached to the second face through a vacuum applied through the first channels;
• applying heat to the first face of the heat transfer coupler, to cause electrical connections to be formed between the semiconductor chip and the substrate;
• and
• removing the semiconductor chip and substrate from the manufacturing tool.