H10W 72/01238
In gaseous form
Official title: {in gaseous form, e.g. by CVD or PVD}
H10W72/01238 (In gaseous form) appears on 736 US grants and 829 published applications in this corpus.
Search patents in H10W- Granted patents
- 736
- Published applications
- 829
- Assignees
- 153
- Inventors
- 1,063
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 2 |
| 2005 | 1 | 3 |
| 2006 | 2 | 2 |
| 2007 | 2 | 1 |
| 2008 | 2 | 4 |
| 2009 | 1 | 6 |
| 2010 | 5 | 5 |
| 2011 | 3 | 31 |
| 2012 | 19 | 59 |
| 2013 | 36 | 72 |
| 2014 | 41 | 62 |
| 2015 | 65 | 79 |
| 2016 | 65 | 53 |
| 2017 | 87 | 65 |
| 2018 | 56 | 75 |
| 2019 | 59 | 62 |
| 2020 | 74 | 67 |
| 2021 | 51 | 53 |
| 2022 | 51 | 51 |
| 2023 | 44 | 21 |
| 2024 | 38 | 26 |
| 2025 | 18 | 18 |
| 2026 | 11 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and method of fabricating the same6 Oct 2026US 12,757,777 B2Samsung Electronics Co., Ltd.
- Package substrate with embedded device, and manufacturing method therefor26 May 2026US 12,642,104 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Indium bump fabrication on non-planar surface19 May 2026US 12,635,547 B1United States of America as represented by the Administrator of NASA
- Half-buried electrical connection insert rod device28 Apr 2026US 12,616,054 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Electronic device21 Apr 2026US 12,609,507 B2Sony Semiconductor Solutions Corporation
- Semiconductor Device and Method of Forming Stacked Encapsulated Conductive Pillar Layers as Vertical Interconnect Structure17 Sep 2026US 2026/0282965 A1STATS ChipPAC Pte. Ltd.
- Method for forming bumps on substrate10 Sep 2026US 2026/0271762 A1Skytech
- Electronic device6 Aug 2026US 2026/0229838 A1Sony Semiconductor Solutions Corporation
- Integrated circuit package and method6 Aug 2026US 2026/0231829 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package including an integrated circuit die and an inductor or a transformer9 Jul 2026US 2026/0198021 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment77US 7,098,127 B2Seiko Epson Corporation · 2006
- Semiconductor device and method of forming an embedded SOP fan-out package74US 9,385,006 B2STATS ChipPAC Pte. Ltd. · 2016
- Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers73US 8,080,445 B1STATS ChipPAC, Ltd. · 2011
- Semiconductor device and method of bonding different size semiconductor die at the wafer level71US 8,993,377 B2STATS ChipPAC, Ltd. · 2015