H10W 72/01236
In solid form
Official title: {in solid form, e.g. by using a powder or by laminating a foil}
H10W72/01236 (In solid form) appears on 150 US grants and 178 published applications in this corpus.
Search patents in H10W- Granted patents
- 150
- Published applications
- 178
- Assignees
- 59
- Inventors
- 276
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 3 |
| 2006 | 0 | 0 |
| 2007 | 1 | 3 |
| 2008 | 0 | 1 |
| 2009 | 2 | 0 |
| 2010 | 1 | 3 |
| 2011 | 1 | 2 |
| 2012 | 0 | 3 |
| 2013 | 5 | 5 |
| 2014 | 4 | 13 |
| 2015 | 10 | 8 |
| 2016 | 5 | 16 |
| 2017 | 13 | 14 |
| 2018 | 11 | 12 |
| 2019 | 14 | 19 |
| 2020 | 17 | 20 |
| 2021 | 13 | 19 |
| 2022 | 14 | 8 |
| 2023 | 13 | 10 |
| 2024 | 13 | 11 |
| 2025 | 7 | 5 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package and method of manufacturing the same8 Sep 2026US 12,733,547 B2Samsung Electronics Co., Ltd.
- Multilayer electrical conductors for transfer printing28 Apr 2026US 12,616,058 B2Daktronics, Inc.
- Semiconductor package including an integrated circuit die and an inductor or a transformer24 Mar 2026US 12,588,222 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for the localized deposition of a material on a metal element30 Sep 2025US 12,431,454 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Semiconductor device and method22 Jul 2025US 12,368,280 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package including an integrated circuit die and an inductor or a transformer9 Jul 2026US 2026/0198021 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Chip package device26 Mar 2026US 2026/0090441 A1STMicroelectronics International N. V.
- Semiconductor Device and Method2 Oct 2025US 2025/0309608 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and method of manufacture18 Sep 2025US 2025/0293174 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit package and method of forming same17 Jul 2025US 2025/0233119 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Chiplets with connection posts40US 10,468,363 B2X-Celeprint Limited · 2019
- Method of forming solder bumps onto an integrated circuit device37US 6,008,071 AFujitsu Limited · 1999
- Electrically conductive structure on a semiconductor substrate formed from printing34US 8,067,305 B2Ultratech, Inc. · 2011
- Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages32US 8,441,118 B2Intel Corporation · 2013
- Structures and methods for low temperature bonding using nanoparticles24US 9,633,971 B2Invensas Corporation · 2017