US 10,468,363 B2Granted

Chiplets with connection posts

AssigneeX-Celeprint Limited

InventorsCarl Prevatte, Christopher Bower, Ronald S. Cok, Matthew Meitl

Life of this patent

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Abstract

A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.

Claims22

Dependent claims

A wafer having printable components, comprising:

a substrate comprising a sacrificial layer comprising patterned sacrificial portions, wherein the patterned sacrificial portions are spaced apart;
and
a plurality of printable components, wherein, for each of the plurality of printable components, the printable component is disposed entirely directly over one of the sacrificial portions and the printable component comprises:
two or more electrically conductive connection posts extending into the one of the patterned sacrificial portions,
a chiplet comprising a semiconductor substrate and two or more chiplet contact pads, and
a dielectric layer in contact with the chiplet and with the two or more electrically conductive connection posts, the dielectric layer being differentially etchable from the sacrificial portions,
wherein the two or more chiplet contact pads are electrically connected to the two or more connection posts extending into the one of the patterned sacrificial portions.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/822,864Filed 10 Aug 2015
Published: US 2017/0048976 A116 Feb 2017
Granted: 5 Nov 2019
Term ends: Not estimatedThe source records don’t support an estimate.

Classification37 codes

H05K 1/112
Pads for surface mounting, e.g. lay-out: directly combined with via connections
H10W 72/071
Interconnections or connectors in packages: connecting or disconnecting
H05K 3/3436
Leadless components: having an array of bottom contacts, e.g. pad grid array or ball grid array components
H10W 72/20
Interconnections or connectors in packages: bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps