Method for the localized deposition of a material on a metal element

A method for localized deposition of a material over an element, the method comprising:

• depositing a portion of the material over a portion of a surface of a support;
• positioning a portion of the element against the portion of the material;
• heat corresponding to an annealing performed at a temperature higher than or equal to a melting temperature of the material, the portion of the material to increase, at an end of the heat treatment, an adhesion force of the material against the portion of the element, materials of the portion of the element and of the portion of the surface of the support being selected such that the adhesion force of the material against the portion of the element is, at the end of the heat treatment, higher than that of the material against the portion of the surface of the support;
• and
• separating the element and the support at an interface between the material and the portion of the surface of the support, the material remaining secured to the portion of the element, wherein:
• the portion of the surface of the support is such that a contact angle between the material in a liquid state and the portion of the surface of the support has a value θCI;
• the portion of the element is such that a contact angle between the material in the liquid state and the portion of the element has a value θC2<θCI;
• the material corresponds to a metallic solder material including at least one of the following metals:
• tin, indium, and silver;
• and
• the portion of the surface of the support includes a metal oxide and the portion of the element includes at least one of the following metals:
• aluminium, copper, and gold.