H10W 72/01223
In liquid form
Official title: {in liquid form, e.g. by dispensing droplets or by screen printing}
H10W72/01223 (In liquid form) appears on 1,191 US grants and 1,367 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,191
- Published applications
- 1,367
- Assignees
- 330
- Inventors
- 1,965
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 5 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 8 | 0 |
| 2000 | 8 | 0 |
| 2001 | 6 | 1 |
| 2002 | 7 | 14 |
| 2003 | 12 | 14 |
| 2004 | 9 | 17 |
| 2005 | 13 | 19 |
| 2006 | 13 | 25 |
| 2007 | 16 | 35 |
| 2008 | 19 | 50 |
| 2009 | 22 | 37 |
| 2010 | 36 | 48 |
| 2011 | 32 | 63 |
| 2012 | 48 | 81 |
| 2013 | 66 | 85 |
| 2014 | 58 | 78 |
| 2015 | 82 | 101 |
| 2016 | 99 | 87 |
| 2017 | 101 | 88 |
| 2018 | 91 | 104 |
| 2019 | 87 | 90 |
| 2020 | 93 | 94 |
| 2021 | 70 | 82 |
| 2022 | 57 | 43 |
| 2023 | 44 | 30 |
| 2024 | 43 | 34 |
| 2025 | 25 | 27 |
| 2026 | 10 | 20 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Package structure and method for fabricating the same1 Sep 2026US 12,727,477 B2Wistron Neweb Corp.
- Sintered metal flip chip joints18 Aug 2026US 12,713,938 B2Texas Instruments Incorporated
- Semiconductor package and manufacturing method therefor11 Aug 2026US 12,708,031 B2LG Innotek Co., Ltd.
- Solder volume for flip-chip bonding5 May 2026US 12,622,284 B2International Business Machines Corporation
- Die attachment structure and method8 Oct 2026US 2026/0314435 A1NXP USA, Inc.
- Semiconductor Device and Method of Forming Stacked Encapsulated Conductive Pillar Layers as Vertical Interconnect Structure17 Sep 2026US 2026/0282965 A1STATS ChipPAC Pte. Ltd.
- Laser printing method for microbumps in packaging three-dimensional integrated circuit17 Sep 2026US 2026/0282988 A1Shanghai Jiao Tong University
- Method for forming copper pillars by thick film screen printing10 Sep 2026US 2026/0271632 A1
- Method for forming copper pillars by copper paste screen printing10 Sep 2026US 2026/0271763 A1
Most cited
By later US patents
- 3DIC stacking device and method of manufacture962US 9,443,783 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Backside method for fabricating semiconductor components with conductive interconnects311US 7,393,770 B2Micron Technology, Inc. · 2008
- Method of mounting resilient contact structures to semiconductor devices254US 5,829,128 AFormFactor, Inc. · 1998
- Chip scale packages and methods for manufacturing the chip scale packages at wafer level220US 6,187,615 B1Samsung Electronics Co., Ltd. · 2001
- Method of making contact tip structures184US 5,864,946 AForm Factor, Inc. · 1999