Solder volume for flip-chip bonding
AssigneeInternational Business Machines Corporation
InventorsToyohiro Aoki, Katsuyuki Sakuma, Hiroyuki Mori, Koki Nakamura, Takashi Hisada
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Abstract
Methods, systems, and structures relating to flip-chip bonding are described. A processor can determine a plurality of target solder volumes to be deposited on a plurality of pads on a surface of a substrate. The plurality of target solder volumes can be variable among the plurality of pads. The processor can determine different thicknesses of different portions of a layer of resist to be deposited across the surface of the substrate. The different thicknesses can define a plurality of solder resist openings having sizes that comply with the plurality of target solder volumes.
Claims8
A method comprising:
- determining, by a processor, a plurality of target solder volumes to be deposited on a plurality of pads on a surface of a substrate, wherein the plurality of target solder volumes is variable among the plurality of pads;
- and
- determining, by the processor, different thicknesses, spanning in a direction perpendicular to the surface of the substrate, of different portions of a layer of resist to be deposited across the surface of the substrate, wherein the different thicknesses define a plurality of solder resist openings having sizes that comply with the plurality of target solder volumes.
Dependencies are inferred from the claim text.