H10W 70/466
Tape carriers or flat leads
Official title: {Tape carriers or flat leads}
H10W70/466 (Tape carriers or flat leads) appears on 1,336 US grants and 1,637 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,336
- Published applications
- 1,637
- Assignees
- 263
- Inventors
- 2,098
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 4 | 0 |
| 1994 | 10 | 0 |
| 1995 | 8 | 0 |
| 1996 | 6 | 0 |
| 1997 | 9 | 0 |
| 1998 | 7 | 0 |
| 1999 | 7 | 0 |
| 2000 | 5 | 0 |
| 2001 | 10 | 5 |
| 2002 | 13 | 8 |
| 2003 | 8 | 9 |
| 2004 | 9 | 12 |
| 2005 | 7 | 6 |
| 2006 | 3 | 10 |
| 2007 | 9 | 41 |
| 2008 | 10 | 35 |
| 2009 | 18 | 51 |
| 2010 | 42 | 52 |
| 2011 | 42 | 44 |
| 2012 | 43 | 70 |
| 2013 | 58 | 64 |
| 2014 | 55 | 76 |
| 2015 | 81 | 99 |
| 2016 | 88 | 95 |
| 2017 | 96 | 80 |
| 2018 | 80 | 91 |
| 2019 | 79 | 82 |
| 2020 | 72 | 101 |
| 2021 | 90 | 107 |
| 2022 | 69 | 108 |
| 2023 | 84 | 119 |
| 2024 | 81 | 132 |
| 2025 | 76 | 96 |
| 2026 | 46 | 44 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device with high draft angle package structure6 Oct 2026US 12,757,753 B2Texas Instruments Incorporated
- Method of making a multi-chip package device6 Oct 2026US 12,757,800 B2Force Mos Technology Co., Ltd.
- Semiconductor device package with flat plate and pin terminals22 Sep 2026US 12,745,653 B2Shindengen Electric Manufacturing Co., Ltd.
- Diode layer stack flip-chip mounted to a leadframe by use of a copper nickel tin metallization stack and diffusion soldering15 Sep 2026US 12,740,438 B2Infineon Technologies Austria AG
- Method for manufacturing semiconductor apparatus and semiconductor apparatus8 Sep 2026US 12,733,511 B2Rohm Co., Ltd.
- Grounded leads in a quad-flat package8 Oct 2026US 2026/0314439 A1STMicroelectronics International N. V.
- Clips for semiconductor package and related methods24 Sep 2026US 2026/0293708 A1Semiconductor Components Industries, LLC
- Packaged device, method for manufacturing, and lead frame27 Aug 2026US 2026/0255985 A1NXP USA, Inc.
- Semiconductor package having dual transistors and method of making the same6 Aug 2026US 2026/0231820 A1Alpha and Omega Semiconductor International LP
- Power semiconductor module30 Jul 2026US 2026/0223757 A1Dynex Semiconductor Limited
Most cited
By later US patents
- Method for producing high speed integrated circuits354US 5,214,845 AMicron Technology, Inc. · 1993
- Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof266US 8,420,447 B2STATS ChipPAC, Ltd. · 2013
- Combination of semiconductor interconnect212US 5,917,242 AMicron Technology, Inc. · 1999
- Symmetrical package for semiconductor die208US 6,256,200 B12001
- Semiconductor device package198US 5,087,961 ALSI Logic Corporation · 1992