H10W 70/465
Bumps or wires
Official title: {Bumps or wires}
H10W70/465 (Bumps or wires) appears on 1,694 US grants and 2,026 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,694
- Published applications
- 2,026
- Assignees
- 367
- Inventors
- 2,883
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 8 | 0 |
| 1998 | 4 | 0 |
| 1999 | 7 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 7 |
| 2002 | 10 | 13 |
| 2003 | 9 | 15 |
| 2004 | 19 | 20 |
| 2005 | 15 | 34 |
| 2006 | 26 | 34 |
| 2007 | 15 | 33 |
| 2008 | 22 | 55 |
| 2009 | 16 | 47 |
| 2010 | 49 | 56 |
| 2011 | 49 | 63 |
| 2012 | 56 | 58 |
| 2013 | 62 | 59 |
| 2014 | 69 | 99 |
| 2015 | 84 | 108 |
| 2016 | 125 | 144 |
| 2017 | 152 | 153 |
| 2018 | 132 | 148 |
| 2019 | 134 | 127 |
| 2020 | 126 | 121 |
| 2021 | 84 | 117 |
| 2022 | 97 | 102 |
| 2023 | 89 | 135 |
| 2024 | 79 | 123 |
| 2025 | 79 | 90 |
| 2026 | 58 | 65 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package assembly with electric field modulation structures6 Oct 2026US 12,757,751 B2Nexperia B. V.
- Electronic device with high draft angle package structure6 Oct 2026US 12,757,753 B2Texas Instruments Incorporated
- Lead frame with a tie bar having branch part29 Sep 2026US 12,751,294 B2Diodes Incorporated
- Semiconductor device and motor driving system15 Sep 2026US 12,738,816 B2Rohm Co., Ltd.
- Integrated circuit25 Aug 2026US 12,721,183 B2Texas Instruments Incorporated
- Apparatus including an isolation assembly1 Oct 2026US 2026/0305369 A1
- Dual die device with conductive plate substrate connection1 Oct 2026US 2026/0305384 A1
- Microelectronic device package with open cavity1 Oct 2026US 2026/0305456 A1Texas Instruments Incorporated
- Power device package1 Oct 2026US 2026/0305466 A1GaNrich Semiconductor Corporation
- Method of manufacturing semiconductor devices and corresponding semiconductor device1 Oct 2026US 2026/0305498 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Semiconductor chip package377US 5,677,566 AMicron Technology, Inc. · 1997
- Method of forming a semiconductor package and structure thereof283US 7,030,469 B2Freescale Semiconductor, Inc. · 2006
- Power semiconductor devices and methods of manufacture273US 7,345,342 B2Fairchild Semiconductor Corporation · 2008
- Flip-chip on lead frame220US 6,482,680 B1Carsem Semiconductor SDN. BHD. · 2002
- Combination of semiconductor interconnect212US 5,917,242 AMicron Technology, Inc. · 1999