Flip-chip on lead frame
AssigneeCarsem Semiconductor SDN. BHD.
InventorsLily Khor, Ong King Hoo
Life of this patent
Estimating the term…
Abstract
There is disclosed a flip-chip-type method of assembling semiconductor devices. The proposed invention offer one step encapsulation process to promote adhesion of die to the lead finger and prevent the potential of shorts from developing between the adjacent bumps (13) or lead fingers. Conventional mold compound (15) is used to reduce localized stress causes by coefficient of thermal expansion (CTE) mismatch between the die (11) and substrate, or the lead frame (12). This is particularly favorable in promoting greater mechanical robustness of the semiconductor devices. With one step encapsulation process proposed by the present invention, manufacturing process is made simpler, faster and relatively cheaper.
Claims18
A flip-chip-type method of attaching a semiconductor die (11) to a lead frame (12), comprising the steps of:
- configuring said semiconductor die (11) with a plurality of predetermined electric contact points (10) so as to accommodate connection to lead fingers of said lead frame (12);
- configuring discrete conductive element (13) over each of said predetermined electric contact points (10);
- depositing solder element to form solder element layers (14) on said lead fingers, said solder element layers (14) are arranged at locations that match with said discrete conductive elements (13);
- and
- securing said semiconductor die (11) to said lead frame (12) through said electric contact points (10), said discrete conductive elements (13) and said solder element layers (14), respectively.
Dependencies are inferred from the claim text.