Semiconductor device and motor driving system

A semiconductor device, comprising:

• a semiconductor chip on which a semiconductor integrated circuit is formed;
• a plurality of leads disposed around the semiconductor chip;
• two or more chip-directed wires connecting two or more leads included in the plurality of leads to the semiconductor chip;
• a package including a sealing resin, the package sealing the semiconductor chip, the plurality of leads, and the two or more chip-directed wires such that part of each of the plurality of leads is exposed out of the sealing resin,
• wherein
• the semiconductor integrated circuit includes:
• a current sensing circuit configured to sense a sensing target current flowing through a sense resistor based on a voltage drop across the sense resistor;
• and
• a main circuit configured to perform predetermined operation based on a result of sensing of the sensing target current,
• the plurality of leads include a first lead connected to a first end of the sense resistor and a second lead connected to a second end of the sense resistor,
• the sense resistor is disposed within the package,
• the sense resistor is formed of a sensing metal member disposed to bridge between the first and second leads without passing through the semiconductor chip, and
• the first lead and the second lead are each connected to the semiconductor chip without passing via the sense resistor and without passing via a conductive member provided outside the package,
• the plurality of leads further includes a third lead and a fourth lead to be short-circuited to the first and second leads, respectively, on a circuit board on which the semiconductor device is to be mounted,
• the two or more chip-directed wires include a first chip-directed wire that connects the third lead to the semiconductor chip and a second chip-directed wire that connects the fourth lead to the semiconductor chip,
• the current sensing circuit is configured to sense the sensing target current based on a potential difference between a connection point between the semiconductor chip and the first chip-directed wire and a connection point between the semiconductor chip and the second chip-directed wire,
• within the package, one end of the first chip-directed wire is wire-bonded to a point on the third lead and another end of the first chip-directed wire is wire-bonded to a point on the semiconductor chip, and
• within the package, one end of the second chip-directed wire is wire-bonded to a point on the fourth lead and another end of the second chip-directed wire is wire-bonded to another point on the semiconductor chip.