H10W 20/432
Comprising crossing interconnections
Official title: {comprising crossing interconnections}
H10W20/432 (Comprising crossing interconnections) appears on 322 US grants and 305 published applications in this corpus.
Search patents in H10W- Granted patents
- 322
- Published applications
- 305
- Assignees
- 122
- Inventors
- 628
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 6 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 6 | 0 |
| 1999 | 5 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 1 |
| 2002 | 6 | 5 |
| 2003 | 5 | 5 |
| 2004 | 9 | 6 |
| 2005 | 4 | 6 |
| 2006 | 5 | 5 |
| 2007 | 5 | 2 |
| 2008 | 0 | 6 |
| 2009 | 1 | 2 |
| 2010 | 5 | 2 |
| 2011 | 1 | 1 |
| 2012 | 0 | 1 |
| 2013 | 2 | 6 |
| 2014 | 4 | 10 |
| 2015 | 12 | 13 |
| 2016 | 6 | 10 |
| 2017 | 15 | 16 |
| 2018 | 20 | 14 |
| 2019 | 12 | 21 |
| 2020 | 22 | 25 |
| 2021 | 22 | 32 |
| 2022 | 25 | 37 |
| 2023 | 22 | 31 |
| 2024 | 28 | 26 |
| 2025 | 20 | 15 |
| 2026 | 14 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Interconnect structure with intra-level metal line connectors29 Sep 2026US 12,751,276 B2International Business Machines Corporation
- Common rail contact8 Sep 2026US 12,733,241 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated circuit structure and manufacturing method thereof1 Sep 2026US 12,727,458 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device interconnects and methods of formation18 Aug 2026US 12,713,680 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Fly-over metal jumper connection18 Aug 2026US 12,713,900 B2International Business Machines Corporation
- Apparatus with thermal distribution network and methods for operating the same16 Jul 2026US 2026/0206582 A1Micron Technology, Inc.
- Integrated circuit including segmented patterns and method for designing the same9 Jul 2026US 2026/0198306 A1Samsung Electronics Co., Ltd.
- Contact structure manufacturing method2 Jul 2026US 2026/0190979 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor package25 Jun 2026US 2026/0182347 A1Samsung Electronics Co., Ltd.
- Semiconductor device and data storage system including the same16 Apr 2026US 2026/0107757 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Microelectronic air-gap structures and methods of forming the same232US 6,509,623 B2Newport Fab, LLC · 2003
- High performance interconnect system for an integrated circuit173US 4,933,743 AFairchild Semiconductor Corporation · 1990
- Method of forming a support structure for air bridge wiring of an integrated circuit168US 5,891,797 AMicron Technology, Inc. · 1999
- Design for high density memory with relaxed metal pitch153US 6,057,573 AVanguard International Semiconductor Corporation · 2000
- High performance interconnect system for an integrated circuit132US 5,117,276 AFairchild Camera and Instrument Corporation · 1992