Interconnect structure with intra-level metal line connectors
AssigneeInternational Business Machines Corporation
InventorsJames P Mazza, Nicholas Anthony Lanzillo, Reinaldo Vega, David Wolpert, Takashi Ando
Life of this patent
Estimating the term…
Abstract
A semiconductor interconnect structure and formation thereof. The semiconductor interconnect structure includes a first metal line, a second metal line, and a third metal line running along a first orientation within a metal level, where the second metal line is located between the first and third metal lines. The semiconductor interconnect structure further includes a metal line connector running along a second orientation within the metal level. The metal line connector is located below the second metal line, and connected to the first and third metal lines.
Claims16
A semiconductor interconnect structure, comprising:
- a first metal line, a second metal line, and a third metal line running along a first orientation within a metal level, wherein the second metal line is located between the first and third metal lines;
- and
- a metal line connector running along a second orientation within the metal level, wherein the metal line connector is located below the second metal line, and connected to the first and third metal lines.
A semiconductor interconnect structure, comprising:
- a first metal line, a second metal line, and a third metal line running along a first orientation within a metal level, wherein the second metal line is located between the first and third metal lines;
- and
- a metal line connector running along a second orientation within the metal level, wherein the metal line connector is located above the second metal line, and connected to the first and third metal lines.
Dependencies are inferred from the claim text.