Apparatus with thermal distribution network and methods for operating the same
AssigneeMicron Technology, Inc.
InventorsLingming Yang, Raghukiran Sreeramaneni, Nevil N. Gajera, Guy S. Perry, IV
Life of this patent
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Abstract
Methods, apparatuses, and systems related to a thermal distribution network are described. The thermal distribution network includes thermally conductive material configured to route thermal energy, generated by a supporting device, along a vertical path and through one or more portions of a semiconductor device stacked over the supporting device.
Claims20
A heterogenous integrated chiplet comprising:
- an interface die having a physical layer interface circuit (PHY) configured to communicate signals with an external circuit;
- and
- a core die mounted over the interface die, the core die including:
- a semiconductor substrate having a set of arrays and a Through Silicon Via (TSV) extending through a thickness of the semiconductor substrate, wherein the TSV overlaps the PHY, and
- a back end of the line (BEOL) structure formed on a side of the semiconductor substrate facing the interface die,
- the BEOL including a thermal distribution network overlapping the PHY and thermally coupled to the TSV, wherein the thermal distribution network includes metallic material configured to route thermal energy away from the PHY and across the BEOL by increasing the density of thermally conductive material in the BEOL.
A semiconductor device configured to be placed over an external device having a heat generating portion therein, the semiconductor device comprising:
- a semiconductor substrate;
- functional circuitry formed on the semiconductor substrate;
- a Through Silicon Via (TSV) extending through a thickness of the semiconductor substrate, wherein the TSV is located at a portion of the semiconductor substrate configured to overlap the heat generating portion of the external device;
- and
- a back end of the line (BEOL) structure formed on the semiconductor substrate and over the functional circuitry,
- the BEOL including a thermal distribution network overlapping and thermally coupled to the TSV, wherein the thermal distribution network includes thermally conductive material configured to remove thermal energy away from the heat generating portion and across the BEOL to the TSV.
A method of manufacturing a semiconductor device, the method comprising:
- providing a semiconductor substrate having a frontside and a backside;
- forming functional circuitry on the frontside of the semiconductor substrate;
- construction a TSV that extends through a thickness of the semiconductor substrate, wherein the TSV is formed at a location that is projected to overlap a heat generating portion of an external device when the semiconductor device is attached over the external device;
- forming a front end of the line (FEOL) structure over the frontside, wherein the BEOL structure includes:
- electrically insulative layers;
- signal traces disposed between the electrically insulative layers and electrically coupled to the functional circuitry;
- a thermal distribution network overlapping and thermally coupled to the TSV wherein the thermal distribution network includes thermally conductive material configured to remove thermal energy away from the heat generating portion and across the BEOL to the TSV.
Dependencies are inferred from the claim text.