Method of forming a support structure for air bridge wiring of an integrated circuit
AssigneeMicron Technology, Inc.
InventorPaul A. Farrar
Life of this patent
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Abstract
A process of manufacturing integrated circuits is disclosed for designing and implementing a hierarchical wiring system. The interconnection requirements are sorted and designed into a particular wiring level according to length. Support structures may be constructed to allow more flexibility in designing air bridge dimensions. The support structures may take the form of lateral ribs or intermediate posts, and may be fabricated of either insulating or conductive material. One integrated circuit described is a memory device, such as a dynamic random access memory.
Claims4
A process for constructing a support structure for an air-bridge in an integrated circuit, the process comprising:
- depositing low temperature SiO.sub.2 to a thickness defining a height of the air-bridge;
- applying a photo resist to the SiO.sub.2 ;
- selectively removing the SiO.sub.2 from an area where the support structure is desired;
- applying a polymer in the area where the SiO.sub.2 was removed;
- planerizing the polymer and the SiO.sub.2 to a common height;
- applying a photo resist to the polymer and the SiO.sub.2 ;
- selectively removing the polymer and/or the SiO.sub.2 from areas where vertical wiring connectors are desired;
- depositing a conductive material over the polymer and the SiO.sub.2, and into the areas defined for the vertical wiring connectors;
- etching a pattern for the air-bridge from the conductive material;
- and
- removing the SiO.sub.2 thereby leaving the air-bridge and polymer support structure.
Dependencies are inferred from the claim text.