Semiconductor device and data storage system including the same

A semiconductor device comprising:

• a lower structure having a memory cell array area and an outer peripheral area outside the memory cell array area;
• and
• an upper structure on the lower structure,
• wherein the upper structure comprises:
• a pad comprising a first lower conductive pattern provided on the outer peripheral area and an upper conductive pattern on the first lower conductive pattern;
• and
• an inductor portion extending from the upper conductive pattern and overlapping the memory cell array area, and defining a spiral coil shape at a level farther from the lower structure than the first lower conductive pattern.

A data storage system comprising:

• a semiconductor device comprising an input/output pad;
• and
• a controller electrically connected to the semiconductor device through the input/output pad and configured to control the semiconductor device,
• wherein the semiconductor device comprises:
• a lower structure comprising a first structure comprising a peripheral circuit, and a second structure comprising a memory cell array area and an outer peripheral area outside the memory cell array area, the second structure vertically overlapping the first structure;
• and
• an upper structure on the lower structure, and
• wherein the upper structure comprises:
• a first lower conductive pattern;
• a second lower conductive pattern, provided at a same level as the first lower conductive pattern, and comprising a first connection region, a second connection region, and an intermediate region between the first connection region and the second connection region;
• a lower insulating structure provided on the lower structure, on side surfaces of the first lower conductive pattern and the second lower conductive pattern, having an upper surface provided at a level farther from the lower structure than upper surfaces of the first lower conductive pattern and the second lower conductive pattern, and defining a first opening exposing at least a portion of an upper surface of the first lower conductive pattern and a second opening exposing at least a portion of an upper surface of the first connection region of the second lower conductive pattern;
• an upper conductive pattern comprising a first portion provided on an upper surface of the lower insulating structure, a second portion extending from the first portion and contacting the upper surface of the first lower conductive pattern exposed by the first opening, and a third portion extending from the first portion and contacting the upper surface of the first connection region of the second lower conductive pattern exposed by the second opening;
• and
• an upper insulating structure provided on the upper conductive pattern and defining a pad opening exposing at least a portion of an upper surface of the second portion of the upper conductive pattern, and
• wherein at least a portion of the first portion of the upper conductive pattern defines a spiral coil shape in a plan view.