H10W 20/2134
Tsvs extending from the semiconductor wafer into back-end-of-line layers
Official title: {TSVs extending from the semiconductor wafer into back-end-of-line layers}
H10W20/2134 (Tsvs extending from the semiconductor wafer into back-end-of-line layers) appears on 1,997 US grants and 2,594 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,997
- Published applications
- 2,594
- Assignees
- 241
- Inventors
- 2,759
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 6 |
| 2003 | 3 | 7 |
| 2004 | 6 | 7 |
| 2005 | 12 | 18 |
| 2006 | 11 | 16 |
| 2007 | 3 | 17 |
| 2008 | 9 | 34 |
| 2009 | 23 | 61 |
| 2010 | 39 | 96 |
| 2011 | 65 | 98 |
| 2012 | 67 | 112 |
| 2013 | 115 | 130 |
| 2014 | 138 | 118 |
| 2015 | 112 | 156 |
| 2016 | 112 | 98 |
| 2017 | 132 | 109 |
| 2018 | 109 | 92 |
| 2019 | 87 | 103 |
| 2020 | 114 | 146 |
| 2021 | 124 | 182 |
| 2022 | 111 | 233 |
| 2023 | 169 | 233 |
| 2024 | 184 | 216 |
| 2025 | 169 | 174 |
| 2026 | 77 | 132 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor structures with through via8 Oct 2026US 2026/0314366 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Low resistance structures in systems8 Oct 2026US 2026/0314467 A1Micron Technology, Inc.
- Through-hole electrode substrate, mems device, manufacturing method of mems device, and multilayered device17 Sep 2026US 2026/0274651 A1TDK Corporation
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- Semiconductor device and method of manufacturing the same10 Sep 2026US 2026/0271798 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices775US 7,157,787 B2Intel Corporation · 2007
- Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices528US 6,762,076 B2Intel Corporation · 2004
- Three-dimensional integrated semiconductor devices526US 6,943,067 B2Advanced Micro Devices, Inc. · 2005
- Method for producing interconnect structures for integrated circuits524US 8,252,659 B2Imec · 2012
- Through-substrate vias and methods for forming the same400US 8,803,292 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2014