Semiconductor device
AssigneeSocionext Inc.
InventorsHirotaka TAKENO, Atsushi OKAMOTO, Wenzhen WANG
Life of this patent
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AssigneeSocionext Inc.
InventorsHirotaka TAKENO, Atsushi OKAMOTO, Wenzhen WANG
Estimating the term…
A semiconductor device includes a substrate; a first power supply line extending in a first direction in plan view on a first surface of the substrate; a first semiconductor layer and a second semiconductor layer provided on a second surface of the substrate opposite to the first surface and arranged side by side in the first direction overlapping the first power supply line in plan view; a first through via formed in the substrate and connecting the first power supply line and the second semiconductor layer; a third semiconductor layer formed above the first semiconductor layer; a fourth semiconductor layer formed above the second semiconductor layer; a first gate formed between the first semiconductor layer and the second semiconductor layer and between the third semiconductor layer and the fourth semiconductor layer; and a first transistor having the first semiconductor layer, the second semiconductor layer, and the first gate.
A semiconductor device comprising:
Dependencies are inferred from the claim text.