H10W 20/058
By depositing on sacrificial masks
Official title: {by depositing on sacrificial masks, e.g. using lift-off}
H10W20/058 (By depositing on sacrificial masks) appears on 271 US grants and 191 published applications in this corpus.
Search patents in H10W- Granted patents
- 271
- Published applications
- 191
- Assignees
- 119
- Inventors
- 589
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 5 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 6 | 0 |
| 1983 | 8 | 0 |
| 1984 | 5 | 0 |
| 1985 | 5 | 0 |
| 1986 | 6 | 0 |
| 1987 | 4 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 4 | 0 |
| 1992 | 8 | 0 |
| 1993 | 8 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 10 | 0 |
| 2001 | 4 | 1 |
| 2002 | 12 | 14 |
| 2003 | 4 | 3 |
| 2004 | 6 | 5 |
| 2005 | 4 | 6 |
| 2006 | 3 | 7 |
| 2007 | 5 | 6 |
| 2008 | 6 | 4 |
| 2009 | 4 | 4 |
| 2010 | 3 | 3 |
| 2011 | 2 | 2 |
| 2012 | 3 | 5 |
| 2013 | 3 | 1 |
| 2014 | 5 | 9 |
| 2015 | 11 | 11 |
| 2016 | 9 | 9 |
| 2017 | 10 | 13 |
| 2018 | 8 | 11 |
| 2019 | 17 | 20 |
| 2020 | 19 | 12 |
| 2021 | 11 | 7 |
| 2022 | 3 | 7 |
| 2023 | 6 | 13 |
| 2024 | 8 | 8 |
| 2025 | 10 | 6 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device structure and methods of forming the same18 Aug 2026US 12,713,883 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Metal wires and methods for manufacturing the same4 Aug 2026US 12,701,940 B2Beijing BOE Technology Development Co., Ltd.
- Forming interconnect structures in semiconductor devices30 Dec 2025US 12,512,363 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Devices with reduced capacitances14 Oct 2025US 12,444,646 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Chip structure with conductive pillar and method for forming the same16 Sep 2025US 12,417,992 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device structure and methods of forming the same8 Oct 2026US 2026/0314359 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Pattern forming method27 Aug 2026US 2026/0251978 A1
- Method for treating semiconductor substrate26 Feb 2026US 2026/0060055 A1Tokuyama Corporation
- Self-aligned via structure and the methods of forming the same29 Jan 2026US 2026/0033313 A1
- Semiconductor device and method for fabricating the same20 Nov 2025US 2025/0357209 A1SK hynix Inc.
Most cited
By later US patents
- Method of forming trench buried wiring for semiconductor device505US 5,266,526 AKabushiki Kaisha Toshiba · 1993
- Flat metal features for microelectronics applications161US 10,840,135 B2Invensas Corporation · 2020
- Method for forming dense multilevel interconnection metallurgy for semiconductor devices128US 4,423,547 AInternational Business Machines Corporation · 1984
- Silicon-containing polyimides as oxygen etch stop and dual dielectric coatings109US 4,692,205 AInternational Business Machines Corporation · 1987
- Method of fabricating airbridge metal interconnects88US 4,857,481 AMotorola, Inc. · 1989