Pattern forming method

Abstract

This pattern forming method includes: a laminating step of laminating a curable resin layer and a support film on a substrate; a curing step of curing the entire curable resin layer; a processing step of processing the curable resin layer into a predetermined pattern by irradiating the curable resin layer after curing with excimer laser light from a side of the support film through a mask; a peeling step of peeling the support film from the curable resin layer after processing; and a forming step of forming a plating layer using the curable resin layer after processing as a mask, and then removing the curable resin layer to form a wiring pattern by the plating layer on the substrate.

Dependencies are inferred from the claim text.