H10W 20/048
By using plasmas or gaseous environments
Official title: {by using plasmas or gaseous environments, e.g. by nitriding}
H10W20/048 (By using plasmas or gaseous environments) appears on 1,132 US grants and 1,075 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,132
- Published applications
- 1,075
- Assignees
- 174
- Inventors
- 1,979
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 7 | 0 |
| 1995 | 5 | 0 |
| 1996 | 13 | 0 |
| 1997 | 17 | 0 |
| 1998 | 21 | 0 |
| 1999 | 32 | 0 |
| 2000 | 45 | 0 |
| 2001 | 79 | 38 |
| 2002 | 66 | 59 |
| 2003 | 55 | 55 |
| 2004 | 43 | 42 |
| 2005 | 47 | 52 |
| 2006 | 26 | 41 |
| 2007 | 26 | 40 |
| 2008 | 24 | 55 |
| 2009 | 29 | 39 |
| 2010 | 43 | 52 |
| 2011 | 44 | 25 |
| 2012 | 33 | 29 |
| 2013 | 29 | 28 |
| 2014 | 25 | 23 |
| 2015 | 26 | 29 |
| 2016 | 25 | 29 |
| 2017 | 37 | 35 |
| 2018 | 43 | 51 |
| 2019 | 41 | 33 |
| 2020 | 32 | 54 |
| 2021 | 43 | 48 |
| 2022 | 35 | 56 |
| 2023 | 33 | 57 |
| 2024 | 40 | 47 |
| 2025 | 34 | 39 |
| 2026 | 23 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Film forming method and semiconductor manufacturing apparatus30 Jul 2026US 2026/0218374 A1Tokyo Electron Limited
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Most cited
By later US patents
- Contact structure of semiconductor device1,648US 9,105,490 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Process for fabricating conformal Ti-Si-N and Ti-B-N based barrier films with low defect density614US 6,017,818 ATexas Instruments Incorporated · 2000
- Semiconductor devices having metal layers as barrier layers on upper or lower electrodes of capacitors597US 6,590,251 B2Samsung Electronics Co., Ltd. · 2003
- Nitrogen treatment of a metal nitride/metal stack555US 6,436,819 B1APPLIED Materials.Inc. · 2002
- Method of using a barrier sputter reactor to remove an underlying barrier layer543US 6,498,091 B1APPLIED Materials.Inc. · 2002