H10P 72/3212
The substrates to be conveyed not being semiconductor wafers or large planar
Official title: {the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames}
H10P72/3212 (The substrates to be conveyed not being semiconductor wafers or large planar) appears on 230 US grants and 223 published applications in this corpus.
Search patents in H10P- Granted patents
- 230
- Published applications
- 223
- Assignees
- 154
- Inventors
- 605
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 6 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 7 | 0 |
| 1999 | 8 | 0 |
| 2000 | 12 | 0 |
| 2001 | 11 | 1 |
| 2002 | 4 | 4 |
| 2003 | 4 | 7 |
| 2004 | 4 | 1 |
| 2005 | 2 | 3 |
| 2006 | 2 | 1 |
| 2007 | 0 | 3 |
| 2008 | 2 | 9 |
| 2009 | 0 | 7 |
| 2010 | 2 | 15 |
| 2011 | 3 | 11 |
| 2012 | 8 | 7 |
| 2013 | 10 | 7 |
| 2014 | 6 | 11 |
| 2015 | 3 | 8 |
| 2016 | 8 | 9 |
| 2017 | 12 | 12 |
| 2018 | 10 | 10 |
| 2019 | 10 | 23 |
| 2020 | 17 | 14 |
| 2021 | 18 | 18 |
| 2022 | 9 | 10 |
| 2023 | 8 | 9 |
| 2024 | 9 | 13 |
| 2025 | 10 | 4 |
| 2026 | 8 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Compound fork device and system including the same11 Aug 2026US 12,703,107 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus for treating substrate9 Jun 2026US 12,652,985 B2Semes Co., Ltd.
- Systems and methods for tray cassette warehousing2 Jun 2026US 12,648,399 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor post-process impact detection device, semiconductor post-process transportation system including same, and impact location tracking method using same26 May 2026US 12,642,045 B2Samsung Electronics Co., Ltd.
- Elastic clamping structure and substrate carrier19 May 2026US 12,635,119 B2Group Up Industrial Co., Ltd.
- Systems and methods for tray cassette warehousing24 Sep 2026US 2026/0293595 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Chip holding tool, chip holding device, and device for manufacturing semiconductor device10 Sep 2026US 2026/0271674 A1Tokyo University of Science Foundation
- Recess-based pick and place for heterogeneous integration16 Jul 2026US 2026/0206525 A1ASML Netherlands B. V.
- Collet apparatus28 May 2026US 2026/0150623 A1Samsung Electronics Co., Ltd.
- Manufacturing method of chip-attached substrate14 May 2026US 2026/0136857 A1Tokyo Electron Limited
Most cited
By later US patents
- Apparatus and method for high throughput sputtering366US 5,683,561 AConner Peripherals, Inc. · 1997
- Modular substrate processing system215US 6,235,634 B1Applied Komatsu Technology, Inc. · 2001
- Mass transfer tool manipulator assembly98US 9,308,649 B2LuxVue Techonology Corporation · 2016
- Multiple head dispensing method80US 6,395,334 B1Speedline Technologies, Inc. · 2002
- Multiple head dispensing system and method78US 6,206,964 B1Speedline Technologies, Inc. · 2001