Apparatus for treating substrate

A substrate treating apparatus, comprising:

• a chamber defining an inner space therein;
• a fluid supply with a supply line and a heater, the supply line being configured to supply a treating fluid to the inner space, the heater being configured to heat the supply line;
• a first exhaust configured to exhaust the inner space;
• a second exhaust configured to exhaust the supply line;
• and
• a controller configured to control the fluid supply, the first exhaust, and the second exhaust such that
• the heater heats the supply line containing a remaining treating fluid during a first time, a substrate not being in the inner space during a standby phase,
• wherein the controller is further configured to control the fluid supply, the first exhaust, and the second exhaust to perform,
• a drying phase for drying a substrate with the treating fluid in the inner space, and
• the standby phase for standing by for an introduction of a substrate into the inner space during a second time,
• wherein the controller is further configured to control the fluid supply, the first exhaust, and the second exhaust such that a pressure of the supply line is maintained at a first pressure during the first time,
• wherein the controller is further configured to control the fluid supply such that the first pressure is at or above a critical pressure to maintain a supercritical state of the treating fluid in the supply line,
• wherein the controller is further configured to control
• the fluid supply and the first exhaust to perform the standby phase, and the drying phase, in turns;
• the second exhaust such that the pressure of the supply line becomes a normal pressure by exhausting the supply line during a first time that is before the drying phase;
• and
• the second exhaust such that a first length of time in the standby phase is longer than a second length of time in the standby phase, when the pressure of the supply line is maintained at a pressure above the critical pressure, the second length of time being a duration of time for the pressure of the supply line to become the normal pressure.

A substrate treating apparatus for dry treating a substrate using a treating fluid in a supercritical state, the substrate treating apparatus comprising:

• a chamber defining an inner space therein;
• a fluid supply having a supply line configured to supply the treating fluid to the inner space;
• a first exhaust configured to exhaust the inner space;
• a second exhaust configured to exhaust the supply line;
• and
• a controller configured to control the fluid supply, the first exhaust, and the second exhaust, and
• wherein the fluid supply includes
• a fluid supply source configured to transfer the treating fluid to the supply line;
• a heater installed at the supply line;
• and
• a valve installed at the supply line, and
• wherein the supply line includes
• a main supply line connected to the fluid supply source;
• a first supply line branching from the main supply line;
• and
• a second supply line branching from the main supply line and connected to the first supply line at a position different from the first supply line, and
• wherein the fluid supply includes
• a main valve in the main supply line;
• a first valve in the first supply line;
• and
• a second valve in the second supply line, and
• wherein the controller is configured to control the fluid supply, the first exhaust, and the second exhaust to perform
• a drying phase for drying the substrate with the treating fluid in the inner space;
• and
• a standby phase for standing by for an introduction of a substrate after the substrate is taken from the inner space, and
• the main valve, the first valve, and the second valve are closed during at least a first part of a time during the standby phase,
• wherein the controller is further configured to control the fluid supply, the first exhaust, and the second exhaust such that a pressure of the supply line having the treating fluid remaining therein between the main valve, the first valve, and the second valve is maintained at a first pressure, and
• wherein the fluid supply further includes a pressure sensor on a downstream side of the main valve and on an upstream side of the first valve or the second valve, and
• wherein the controller is further configured to control the fluid supply to open the main valve and supply the treating fluid through the supply line, when a pressure value measured by the pressure sensor is lower than the first pressure at a time when the main valve, the first valve, and second valve are closed.